Guangdong, China
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
Number of Foreign Trading Staff:
4
Sample Available

Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder, Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement, Ultra-Thin Chips Easily Broken High Precision Peeling Technology Ultra Thin Chip Die Sorter Die Sorting Machine and so on.

Diamond Member
Audited Supplier Audited Supplier

IC package Industry

Total 150 IC package Industry Products