Precision High Speed Automatic Semiconductor Industry Equipment IC Package Wafer Die Bonder Die Bonding Attach Machine

• After-sales Service: Provide
• Condition: New
• Speed: High Speed
• Model NO.: MD-JC360/MD-JC380
• Precision: Precision
• Certification: CE
• Warranty: 1 Year
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Crate Packaging
• Specification: 1200mm*1200mm*1500mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Since 2014,
One-stop Professional Solution for 
Semiconductor Front-end and IC TO Package Equipments Line

Product description:

Automatic die bonder 



MD-JC360: 8inch wafer die bonder manual upload and dowload.

MD-JC380:12inch wafer die bonder manual upload and download


FAQ
1. who are we?
We are based in Guangdong, China, start from 2014,sell to North America(00.00%),Western Europe(00.00%),South Asia(00.00%),Southeast Asia(00.00%),Mid East(00.00%),South America(00.00%),Eastern Asia(00.00%),Northern Europe(00.00%). There are total about 11-50 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3.what can you buy from us?
Soldering machine,Precision spot welding machine,Plasma cleaning machine,Glue dispenser,Screw machine

4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.

5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,FCA,CPT;
Accepted Payment Currency:USD,EUR,HKD,CNY;
Accepted Payment Type: T/T,PayPal,Cash;
Language Spoken:English,Chinese