Guangdong, China
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing ...
Year of Establishment:
2014-12-30
Registered Capital:
147802.18 USD
Main Markets:
North America, Europe
Sample Available
Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering IGBT Tr Mcm Sensor Mems Eutectic Bump Welding Chip Welder Vacuum Eutectic Reflow Soldering Oven Vacuum Welding Furnace, Semiconductor Welding Machine Chip Packaging Soldering Eutectic Welding Vacuum Reflow Soldering Furnace Nitrogen Vacuum Eutectic Reflow Oven, Semiconductor Wafers 2D 3D Defect Detection Chip Tray to Tray Reel Optical Inspection IGBT Module Testing Automated Optical Inspection Aoi and so on.
Diamond Member
Since 2017
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