Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
Number of Foreign Trading Staff:
4
Sample Available
Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering Semiconductor Packaging Integrated Circuits Gold Wire Bonding Manual-Semi-Auto Ball Bonder, Semiconductor Packaging Equipment Mdzw-Bb1850 Manual Semi Auto Ball Bonder Wire Ball Bonding Machine, Integrated Circuit Microwave Laser Packaging Equipment Ball Welding Wedge Welding Machine Gold Wire Bonder Wire Bonding and so on.
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Since 2017
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