Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
International Commercial Terms(Incoterms):
EXW
Wire Bonder, Soldering Machine, Bond Tester manufacturer / supplier in China, offering High-Precision Semiconductor Thermoelectric Refrigeration Chip Tec Die Placement Machine, High-Precision ±15 Micrometer Rotary Indexing Tec Thermo Electric Cooler Die Assembly Machine, Miniature Micro Thermoelectric Coolers Tec Assembly Machine Tec Die Bonder and so on.
Diamond Member
Audited Supplier
