Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
International Commercial Terms(Incoterms):
EXW
Wire Bonder, Soldering Machine, Bond Tester manufacturer / supplier in China, offering Gold Wire Ball Bonder Test Testing Machine Bond Pull Tester, IC COB Package Bond Testing Machine Wire Bond Pull Push Strength Tester, Tec Blue Film Chip Wafer Packaging High Precision Eutectic Die Bonder Attach and so on.
Diamond Member
Audited Supplier
