Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
International Commercial Terms(Incoterms):
EXW
Wire Bonder, Soldering Machine, Bond Tester manufacturer / supplier in China, offering Semiconductor Laboratory Device University Wafer Fab DMD Maskless Lithography Machine, DMD Digital Micromirror Device Maskless Lithography Machine for Small-Scale R&D Laboratory, Semicon Wafer Desktop Micro Nano Chip Ultra-High Precision DMD Maskless Lithography and so on.
Diamond Member
Audited Supplier
