Hot Products
Semiconductor IC to LED Package Equipment Wire Bonder Wire Bonding Machine
US$5,000.00-99,999.00 / Piece
1 Piece (MOQ)
Double-row Products
US$36,000.00-40,000.00 / Piece
1 Piece (MOQ)
US$100,000.00-130,000.00 / Piece
1 Piece (MOQ)
US$27,000.00-31,000.00 / Piece
1 Piece (MOQ)
US$3,000.00-999,999.00 / Piece
1 Piece (MOQ)
US$100,000.00-1,000,000.00 / Piece
1 Piece (MOQ)
US$5,000.00-99,999.00 / Piece
1 Piece (MOQ)
Featured Products
US$120,000.00-150,000.00 / Piece
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US$35,000.00-41,000.00/ Piece
1 Piece (MOQ)
US$3,000.00-10,000.00/ Piece
1 Piece (MOQ)
US$5,000.00-30,000.00/ Piece
1 Piece (MOQ)
US$3,000.00-8,000.00/ Set
1 Set (MOQ)
US$2,000.00-6,500.00/ Piece
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US$15,000.00/ Piece
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Featured Products
US$50,000.00-100,000.00 / Piece
1 Piece (MOQ)
US$50,000.00-99,999.00/ Piece
1 Piece (MOQ)
US$50,000.00-80,000.00/ Piece
1 Piece (MOQ)
US$72,000.00-150,000.00/ Piece
1 Piece (MOQ)
US$72,000.00-150,000.00/ Piece
1 Piece (MOQ)
US$5,000.00-99,999.00/ Piece
1 Piece (MOQ)
Featured Products
US$85,000.00-150,000.00 / Piece
1 Piece (MOQ)
US$27,000.00-31,000.00/ Piece
1 Piece (MOQ)
US$46,000.00-183,500.00/ Piece
1 Piece (MOQ)
US$100,000.00-150,000.00/ Piece
1 Piece (MOQ)
US$69,000.00-105,000.00/ Piece
1 Piece (MOQ)
Featured Products
US$3,000.00-10,000.00 / Piece
1 Piece (MOQ)
US$3,000.00-999,999.00/ Piece
1 Piece (MOQ)
US$9,000.00-16,000.00/ Piece
1 Piece (MOQ)
US$2,000.00-10,000.00/ Piece
1 Piece (MOQ)
US$1,500.00-3,000.00/ Piece
1 Piece (MOQ)
US$5,000.00-10,000.00/ Piece
1 Piece (MOQ)
Featured Products
US$115,000.00-150,000.00 / Piece
1 Piece (MOQ)
US$35,000.00-55,000.00/ Piece
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US$12,000.00-17,000.00/ Piece
1 Piece (MOQ)
US$140,000.00-160,000.00/ Piece
1 Piece (MOQ)
US$12,000.00-30,000.00/ Piece
1 Piece (MOQ)
US$120,000.00-135,000.00/ Piece
1 Piece (MOQ)
Featured Products
US$25,000.00-31,000.00 / Piece
1 Piece (MOQ)
US$25,000.00-31,000.00/ Piece
1 Piece (MOQ)
US$11,500.00-13,900.00/ Piece
1 Piece (MOQ)
US$12,000.00-30,000.00/ Piece
1 Piece (MOQ)
US$140,000.00-160,000.00/ Piece
1 Piece (MOQ)
Double-row Products
US$50,000.00-80,000.00 / Piece
1 Piece (MOQ)
US$4,500.00-10,000.00 / Piece
1 Piece (MOQ)
US$51,000.00-80,000.00 / Piece
1 Piece (MOQ)
US$11,500.00-13,900.00 / Piece
1 Piece (MOQ)
US$36,000.00-40,000.00 / Piece
1 Piece (MOQ)
US$35,000.00-41,000.00 / Piece
1 Piece (MOQ)
US$27,000.00-31,000.00 / Piece
1 Piece (MOQ)
Featured Products
US$3,500.00-10,000.00 / Set
1 Set (MOQ)
US$3,000.00-8,000.00/ Set
1 Set (MOQ)
US$4,050.00-15,500.00/ Piece
1 Piece (MOQ)
US$3,500.00-15,500.00/ Piece
1 Piece (MOQ)
US$4,050.00-10,000.00/ Piece
1 Piece (MOQ)
US$4,050.00-10,000.00/ Piece
1 Piece (MOQ)
US$6,050.00-15,500.00/ Piece
1 Piece (MOQ)
Double-row Products
US$5,000.00-30,000.00 / Piece
1 Piece (MOQ)
US$2,000.00-20,000.00 / Piece
1 Piece (MOQ)
US$2,800.00-6,000.00 / Set
1 Set (MOQ)
US$2,000.00-6,500.00 / Piece
1 Piece (MOQ)
US$30,000.00-60,000.00 / Piece
1 Piece (MOQ)
US$2,500.00-6,000.00 / Set
1 Set (MOQ)
US$1,500.00-6,000.00 / Set
1 Set (MOQ)
COMPANY PROFILE
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014, the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
Our chief technical expert comes from the School of Mechanical Engineering, South China University of Technology, and we are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.
We provide the equipment for semiconductor packaging factories and laboratories: Die bonder, Wire bonder, Glue encapsulate machine, Bond tester, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, etc.
We provide the equipment for semiconductor Fab factories and lab including: DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, and line of laboratory equipment.
We also provide the equipment for electronic and battery pack assembly plants: Soldering machine, Glue dispenser, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance welder etc.
We are engaged in the trade of microelectronic equipment and semiconductor equipment in Chinese Mainland, not only sell equipment, but also provide you with comprehensive professional solutions and after-sales services.
Until today, our brand's products have spread to major industrialized countries' factory and laboratories around the world, helping customers improve efficiency, reduce costs, and improve product quality.
Since 2014, the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
Our chief technical expert comes from the School of Mechanical Engineering, South China University of Technology, and we are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.
We provide the equipment for semiconductor packaging factories and laboratories: Die bonder, Wire bonder, Glue encapsulate machine, Bond tester, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, etc.
We provide the equipment for semiconductor Fab factories and lab including: DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, and line of laboratory equipment.
We also provide the equipment for electronic and battery pack assembly plants: Soldering machine, Glue dispenser, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance welder etc.
We are engaged in the trade of microelectronic equipment and semiconductor equipment in Chinese Mainland, not only sell equipment, but also provide you with comprehensive professional solutions and after-sales services.
Until today, our brand's products have spread to major industrialized countries' factory and laboratories around the world, helping customers improve efficiency, reduce costs, and improve product quality.
Authentication
Main Products:
Wire Bonder
,
Soldering Machine
,
Bond Tester
,
Grinder and Polisher
,
Dicing Saw
,
Die Bonder
,
...
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
International Commercial Terms(Incoterms):
EXW
Solutions
OEM/ODM
Factory Tour
Sample Order