Automatic Wire Ball Bonder / IC to Package Wire Bonding Machine

Product Details
Control Mode: CNC
Voltage: AC220V
Size: 1230mm*940*1660
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  • Automatic Wire Ball Bonder / IC to Package Wire Bonding Machine
  • Automatic Wire Ball Bonder / IC to Package Wire Bonding Machine
  • Automatic Wire Ball Bonder / IC to Package Wire Bonding Machine
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  • Overview
  • Product Description
Overview

Basic Info.

Weight
800 Kg
Rated Power
1200 W
Compressed Air
≥0.3~0.5 Bar
Specification
1230mm*940*1660
Trademark
minder-hightech
Origin
China

Product Description

Automatic Wire Ball Bonder / IC to Package Wire Bonding Machine
 

Product Description


Automatic wire ball bonder

Automatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding Machine

Technical Specification

X-Y stage stroke:

X-Y stroke: 65*70 mm

X-Y stage accuracy: 0.04 mil(1um)

Z bonder stroke: 9.0 mm

Image recognition system and optical system

Image recognition method: 256 grey scale, can recognize R/G/B and matte chips

Resolution: 640*480

Optical magnification: 2~4, adjustable

Image recognition accuracy: ±0.37 um

Ultrasonic generator and transducer

Ultrasonic generator: UTHE 10H-P2

Ultrasonic transducer: UTHE 70PT

Temperature controller: OMRON E5CSL

User interface: Windows xp system, Chinese and English language

Program memory size: 1000

Min golden wire: 0.5 mil

Velocity

Bonding cycle: 70ms/2mm wire

Unit per hour: 28K (single wire), 15K (dual wire)

Working condition

Voltage/Frequency: AC220V/50-60Hz

Compressed air: ≥0.3~0.5 Bar

Rated power: 1200 W

Gas consumption: 80 LMP

Weight and size

Weight: 800 kg

Size: 1230mm*940*1660

Automatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding Machine
Automatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding MachineAutomatic Wire Ball Bonder / IC to Package Wire Bonding Machine
We have 16 years of experience in equipment,
and we can provide you with a one-stop IC Package Line Equipment solution !!

 

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