Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement

Product Details
After-sales Service: 1 Year
Condition: New
Speed: High Speed
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Address
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, ...
Registered Capital
1,000,000 RMB
  • Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
  • Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
  • Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
  • Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
  • Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
  • Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
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Basic Info.

Model NO.
MDND-120UT
Precision
High Precision
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Type
Ultra High-speed Chip Mounter
Transport Package
Wooden Case
Trademark
MINDER-HIGHTECH
Origin
China
Production Capacity
1000

Product Description

Ultra Thin Die Sorter MDND-120UT
Die Thickness Minimum :50um (Thinner Pending Discuss )
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
Project Parameters
Equipment Name MDND-120UT multi-function die bonder
Equipment Model MDND-120UT
Bonding Accuracy/Angle ±20um, ±0.5 (calibration film)
Bond Force 50~2000gf
CPH 1000 (50ms process time, final efficiency depends on process and process time)
Chip Size 0.5~15mm
Dustproof Level Class 1000
Compatible Substrate/Tray MAX: 300*200mm
Compatible Auxiliary Material Fixture Expander Rings: 4"/6" * 3pcs, 8"*1pcs
Equipment Size Wafer Ring: 4"/6"/8"/12" * 1pcs
Weight 1610 x 1420 x 1700mm
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
Product Introduction:
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement

Technology Core:
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementThis solution is applicable to chip sizes:
0,65х0,65
4,6х4,6
2,7х1,6
2,0х1,6
1,55х1,15
2,3х1,75
1,6х1,4

Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementThis solution is applicable to chips:
>50um chips
Size: ≥6mm

Factory Real Shoots:
Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

Advanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die PlacementAdvanced Semiconductor Packaging Ultra Thin Die Chip High Precision Peeling Technology Eutectic Crystal Planting Die Placement
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

 

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