After-sales Service: | 1 Year |
---|---|
Condition: | New |
Speed: | High Speed |
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Project | Parameters |
Equipment Name | MDND-120UT multi-function die bonder |
Equipment Model | MDND-120UT |
Bonding Accuracy/Angle | ±20um, ±0.5 (calibration film) |
Bond Force | 50~2000gf |
CPH | 1000 (50ms process time, final efficiency depends on process and process time) |
Chip Size | 0.5~15mm |
Dustproof Level | Class 1000 |
Compatible Substrate/Tray | MAX: 300*200mm |
Compatible Auxiliary Material Fixture | Expander Rings: 4"/6" * 3pcs, 8"*1pcs |
Equipment Size | Wafer Ring: 4"/6"/8"/12" * 1pcs |
Weight | 1610 x 1420 x 1700mm |