50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder

Product Details
After-sales Service: 1 Year
Condition: New
Speed: High Speed
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Address
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, ...
Registered Capital
1,000,000 RMB
  • 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
  • 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
  • 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
  • 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
  • 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
  • 50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
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Basic Info.

Model NO.
MDND-120UT
Precision
High Precision
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Type
Ultra High-speed Chip Mounter
Transport Package
Wooden Case
Trademark
MINDER-HIGHTECH
Origin
China
Production Capacity
1000

Product Description

Ultra Thin Die Sorter MDND-120UT
Die Thickness Minimum :50um (Thinner Pending Discuss )
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
Project Parameters
Equipment Name MDND-120UT multi-function die bonder
Equipment Model MDND-120UT
Bonding Accuracy/Angle ±20um, ±0.5 (calibration film)
Bond Force 50~2000gf
CPH 1000 (50ms process time, final efficiency depends on process and process time)
Chip Size 0.5~15mm
Dustproof Level Class 1000
Compatible Substrate/Tray MAX: 300*200mm
Compatible Auxiliary Material Fixture Expander Rings: 4"/6" * 3pcs, 8"*1pcs
Equipment Size Wafer Ring: 4"/6"/8"/12" * 1pcs
Weight 1610 x 1420 x 1700mm
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
Product Introduction:
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder

Technology Core:
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die BonderThis solution is applicable to chip sizes:
0,65х0,65
4,6х4,6
2,7х1,6
2,0х1,6
1,55х1,15
2,3х1,75
1,6х1,4

50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die BonderThis solution is applicable to chips:
>50um chips
Size: ≥6mm

Factory Real Shoots:
50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder50um Ultra-Thin Die Sorter Die Sorting Machine Advanced Precision Semiconductor Die Bonder
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

 

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