| Customization: | Available |
|---|---|
| After-sales Service: | 1 Year |
| Function: | Wire Bonder |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
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Bonding Capability | 48ms/w(2mm Wire Length) |
Bonding Speed | +/-2Ym |
Wire Length | Max 8mm |
Wire Diameter | 15-65ym |
Wire Type | Au,Ag,Alloy,CuPd,Cu |
Bonding Process | BSOB/BBOS |
Looping Control | Ultra Low Looping<50ym |
Bonding Area | 56*80mm |
XY Resolution | 0.1um |
Ultrasonic Frequence | 138KHZ |
PR accuracy | +/-0.37um |
Applicable Magazine | |
L | 120-305mm |
W | 36-98mm |
H | 50-180mm |
Pitch | Min 1.5mm |
Applicable Leadframe | |
L | 100-300mm |
W | 28-90mm |
T | 0.1-1.3mm |
Conversion Time | |
Different Leadframe | <15min |
Same Leadframe | <4min |
Operation Interface | |
MMI Language | Chinese, English |
Dimension, Weight | |
Overall Dimension W*D*H | 950*920*1850mm |
Weight | 750KG |
Facilities | |
Voltage | 190-240V |
Frequency | 50Hz |
Compressed Air | 6-8Bar |
Air Consumtion | 80L/min |
Adaptability | 1-High efficient transducer,more reliable quality ofbond |
2-Table tear and Clamp tear | |
3-Sectionalized bonding parameter, for the different interface | |
4-Multi sub-program to be combined | |
5-SECS/GEM protocol | |
Stability | 6-Real time detection of wire deformation |
7-Real time detection of ultrasonic power | |
8-Second display screen | |
Consistency | 9-Constant loop height,loop length |
10-online BTO for wedge tool calibration by uplook video. | |
Scope of application | Discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc |
Welding accuracy | ±3um |
Welding line area | 305mm in X direction, 457mm in Y direction, 0~180 ° rotation range |
Ultrasonic range | 0~4W control accuracy, ladder flexible application capability |
Arc control | Fully programmable |
Cavity depth range | Maximum 12mm |
Bonding force | 0~220g |









