Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
Number of Foreign Trading Staff:
4
Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering Advanced Packaging Equipment Thermal Compressionthermocompression High Accuracy Flip Chip Bonder Bonding Machine, Thermo Compression Die Bonding or Die Attach Machine / Thermal Compression Bonder, Advanced Packaging Equipment High Accuracy Flip Chip Thermal Compression Bonder and so on.
Diamond Member
Audited Supplier
