Mddb550 Full-Automatic COB Smart Die Bonder

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Weight: About 450kg
Diamond Member Since 2017

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1000000 RMB
  • Mddb550 Full-Automatic COB Smart Die Bonder
  • Mddb550 Full-Automatic COB Smart Die Bonder
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
MDDB550
Product Model
Mddb550
Die Bond Speed
3000-5000 Pieces/Hours
Die Bond Precision
±0.05mm
Transport Package
1100mm*980mm*1660mm
Specification
1100mm*980mm*1660mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description

 

Product description: MDDB550 Full-automatic COB Smart Die Bonder
Mddb550 Full-Automatic COB Smart Die BonderEquipment features
1. double-camera full-alignment recognition and positioning system pioneered by the Eagle-eye and the double die bond platform can realize continuous-cycled and uninterrupted operations. The products can be arranged and mounted at will.
2. Double solid die bond mode, which can mount different kinds of IC at the same time. Up to 8 boxes can be mounted at the same time.
3. It has automatic angle correction function and its IC can be mounted at 360 degrees, which can ensure better die bond effect.
4. Customized smart die bond mode can simultaneously solidify multi-chip boards of various PCB boards and smartly identify bad products;
5. Dispensing is done before die bond, which can integrate dispensing and die bond into one.
6. Under the compatible mechanical positioning mode with fixture positioning function, products with components on the back or products not suitable for aluminum disc operation can be mounted;
7. All-english operation interface, fully computerized input parameters and control mode  are easy to operate and understand;

 
Equipment specifications  
Product model MDDB550
Die bond speed 3000-5000 pieces/hours
Die bond precision ±0.05mm
X/Y precision ±0.03mm
Dispensing speed 200ms/piece
Rotating precision ±1 degree
Mounting head Use imported rubber suction nozzles
IC mounting scope 0.2mm*0.2mm-18mm*18mm
Vacuum standard 0.5Mpa
Mounting scope 160(x)*250(y)*2
Recognition method Full-visual automatic alignment of IC/PCB board
Programming method Smart software programming
Operating system Windows2000/XP
Power supply 220V,50HZ
Equipment power 850W
Machine dimensions 1100mmx980mmx1660mm
Machine weight About 450Kg
Mddb550 Full-Automatic COB Smart Die BonderFAQ
1. who are we?
We are based in Guangdong, China, start from 2014,sell to North America(00.00%),Western Europe(00.00%),South Asia(00.00%),Southeast Asia(00.00%),Mid East(00.00%),South America(00.00%),Eastern Asia(00.00%),Northern Europe(00.00%). There are total about 11-50 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3.what can you buy from us?
Soldering machine,Precision spot welding machine,Plasma cleaning machine,Glue dispenser,Screw machine

4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.

5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,FCA,CPT
;
Accepted Payment Currency:USD,EUR,HKD,CNY;
Accepted Payment Type: T/T,PayPal,Cash;
Language Spoken:English,Chinese




 

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