After-sales Service: | 1 Year |
---|---|
Warranty: | 1 Year |
Weight: | About 450kg |
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Product description: MDDB550 Full-automatic COB Smart Die Bonder
Equipment specifications | |
Product model | MDDB550 |
Die bond speed | 3000-5000 pieces/hours |
Die bond precision | ±0.05mm |
X/Y precision | ±0.03mm |
Dispensing speed | 200ms/piece |
Rotating precision | ±1 degree |
Mounting head | Use imported rubber suction nozzles |
IC mounting scope | 0.2mm*0.2mm-18mm*18mm |
Vacuum standard | 0.5Mpa |
Mounting scope | 160(x)*250(y)*2 |
Recognition method | Full-visual automatic alignment of IC/PCB board |
Programming method | Smart software programming |
Operating system | Windows2000/XP |
Power supply | 220V,50HZ |
Equipment power | 850W |
Machine dimensions | 1100mmx980mmx1660mm |
Machine weight | About 450Kg |