• Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
  • Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
  • Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
  • Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
  • Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
  • Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover

Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover

After-sales Service: 1 Year
Certification: CE
Warranty: 12 Months
Automatic Grade: Semiautomatic
Installation: Vertical
Driven Type: Electric
Diamond Member Since 2017

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  • Overview
  • Product Description
  • Product Parameters
  • Company Profile
Overview

Basic Info.

Model NO.
0
Mould Life
>1,000,000 Shots
Weight
800
Plasma Source
RF
Applicable Scope
4~8inch
Single Processing Slice Count
1
Transport Package
Minder-Hightech
Specification
850mmx900mmx1850mm
Trademark
minder-hightech
Origin
China

Product Description




 
Product Description

RIE PLASMA Glue Remover
Silicon carbide etching
Surface cleaning after etching
DESCUM
Hard mask layer, dry removal
Silicon oxide or silicon nitride etching
Removal of optical resistance between media
Surface residue removal
Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover

Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue RemoverSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
Semiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue RemoverSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue RemoverSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue RemoverSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover
Product Parameters

 

PLASMA source RF
power ICP 1000w
BIAS 600w(option)
Applicable scope 4~8inch
Single processing slice count 1
Appearance dimensions 850mmx900mmx1850mm
System control PLC
Automation level Manual

 

Company Profile

We have 16 years of experience in equipment sales ,and can provide you with a one-stop IC Package Line Equipment solution!!
RIE PLASMA Glue Remover
Silicon carbide etching
Surface cleaning after etching
DESCUM
Hard mask layer, dry removal
Silicon oxide or silicon nitride etching
Removal of optical resistance between media
Surface residue removalSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue RemoverSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue RemoverSemiconductor Chip Manufacturing Equipment Silicon Carbide Etching Rie Plasma Glue Remover

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