Silicon Carbide Etching Wafer Surface Clean Residue Removal Rie Plasma Glue Remover

• After-sales Service: 1 Year
• Warranty: 1 Year
• Type: Electrical Etching Machine
• Object: Wafer
• Usage: Rie
• Certification: CE
• Model NO.: 0
• Etching Type: Double Spray
• Precision: High Precision
• Condition: New
• Applicable Scope: 4~8 Inch
• Single Processing Slice Count: 1 and 2
• System Control: Industrial Control System
• Automation Level: Automatic
• Transport Package: Minder-Hightech
• Specification: 1080x1840x1800mm / 1340x2050x1800mm
• Trademark: minder-hightech
• Origin: China

Product Description

Product Description

ICP PLASMA Glue remover 

ASKING
Polymer removal
Dry removal of hard mask layer
Photoresistance removal after ion implantation
Photoresistance removal in BAW/SAW process
Dry cleaning of anti reflective graphic film layer
Surface residue removal
Surface cleaning after etching
DESCUM

Product Parameters

 

PLASMA source		RF	RF
power	ICP	1000w	1000w
	BIAS	600w(option)	600w(option)
Applicable scope		4~8 inch	4~8 inch
Single processing slice count		1	2
Appearance dimensions		1080x1840x1800mm	1340x2050x1800mm
System control		Industrial control system	Industrial control system
Automation level		automatic	automatic

Detailed Photos

 

 

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