Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Stone Polishing Machine
Diamond Member Since 2017

Suppliers with verified business licenses

Audited Supplier Audited Supplier

Audited by an independent third-party inspection agency

Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
  • Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
  • Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
  • Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
  • Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
  • Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
Find Similar Products

Basic Info.

Model NO.
MDHD-9B
Control
CNC
Automation
Automatic
Precision
High Precision
Application
Ceramics, Glass, Jadestone, Cement Brick, Concrete Curb, Granite, Marble
Type for Grinding Machine
Special Grinding Machine
Grinding Machine Type
Vibration Polishing Machine
Grinding Method
Semi-Dry Grind
Certification
CE
Condition
New
Transport Package
Wooden Case
Trademark
MINDER-HIGHTECH
Origin
China
Production Capacity
1000

Product Description

MDHD-9B Double Side Lapping Polishing Machine

This equipment is mainly used for simultaneous grinding and polishing of the upper and lower parallel end surfaces of thin precision parts made of non-metallic and metal hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials.

Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping MachineSilicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
Main Technical Parameters:
Item Specifications
Grinding disc size Φ640mm×Φ235mm×30mm
Maximum grinding workpiece diameter Φ210mm
Planetary wheel parameters English DP12, Z=108 Metric M=2, Z=114
Minimum workpiece thickness 0.40mm
Number of planetary wheels per disc 5
Number of grinding workpieces per disc (1)Φ50mm, 40 pieces
(2)Φ75mm, 25 pieces
(3)Φ100mm, 10 pieces
Grinding disc speed 0~56rpm
Power supply AC380V, 50Hz
Air source 0.5~0.6Mpa
Dimensions 1650mm×1150mm×2530mm

Rack structure and physical picture
Silicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping MachineSilicon Ceramic Wafer Optical Glass Semiconductor Metal Materials Dual Parallel End Face Grinding and Polishing Lapping Machine
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 


FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier