Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Stone Polishing Machine
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
  • Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
  • Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
  • Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
  • Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
  • Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
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  • Overview
  • Specification
  • Packing & Delivery
  • Company Profile
  • FAQ
Overview

Basic Info.

Model NO.
MDHD-9B
Control
CNC
Automation
Automatic
Precision
High Precision
Application
Ceramics, Glass, Jadestone, Cement Brick, Concrete Curb, Granite, Marble
Type for Grinding Machine
Special Grinding Machine
Grinding Machine Type
Vibration Polishing Machine
Grinding Method
Semi-Dry Grind
Certification
CE
Condition
New
Transport Package
Wooden Case
Trademark
MINDER-HIGHTECH
Origin
China
Production Capacity
1000

Product Description

MDHD-9B Double Side Lapping Polishing Machine
This equipment is mainly used for simultaneous grinding and polishing of the upper and lower parallel end surfaces of thin precision parts made of non-metallic and metal hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials.
Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
Specification
NO.
Item
Specifications
1
Grinding disc size
Φ640mm×Φ235mm×30mm
2
Maximum grinding workpiece diameter
Φ210mm
3
Planetary wheel parameters
English DP12, Z=108 Metric M=2, Z=114
4
Minimum workpiece thickness
0.40mm
5
Number of planetary wheels per disc
5
6
Number of grinding workpieces per disc
(1)Φ50mm, 40 pieces

(2)Φ75mm, 25 pieces

(3)Φ100mm, 10 pieces
7
Grinding disc speed
0~56rpm
8
Power supply
AC380V, 50Hz
9
Air source
0.5~0.6Mpa
10
Dimensions
1650mm×1150mm×2530mm
Rack structure and physical picture

Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
Packing & Delivery
Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
Double Side Lapping Polishing Machine for Silicon Wafers Ceramic Optical Glass Quartz Crystals Semiconductor Materials
Company Profile

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014, the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
 
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
 
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
 
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
 
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
 
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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