MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine

• After-sales Service: 1 Year
• Warranty: 1 Year
• Weight: 280kg
• Model NO.: MD-Etech1850g
• Transport Package: Wooden Box Packaging
• Specification: 760x820x1450mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

MD-Etech1850G Full-Auto Ultrasonic Thin Wire wedge Bonder

Feature
With update software suitable for WIN7 OS.
With new computer I5 inside
With new camera and Z system.
*Up to 8 wires/second for 2mm wire
*Strong T-motor ensures the table movement speed
*Applicable for the thin AL wire from 15-50um
*Deep recessed capability up to 3mm by 45° transducer

SPECIFICATION

Bond Head and Table
XYtravel	4"X4"(LED)
θ	+/- 360°
Ztravel	0.4"
Resolution	0.02 mil
Bond angle	30°
Wire Size	0.7 mil -2.0 mil
Bond force	15-200gm(programmable)
Bond Power	0-2watt(programmable)
Bond time	programmable
Bond head clearance	4.8mm
F/T resolution	programmable
Bonding Throughput	UPH 14K
( based on 2 mm wire length)
Transducer and Power Unit
Transducer	Aluminum alloy light weight type
Power generator	Auto-Cal ultrasonic generator
Alignment Reference
Die	0,1 or 2 points
Substrate	0.1 or 2 points
PR System
Programmable search range
XY	±1mm(Magnification 3.5X)
θ	±15"@1"Resolution Satio
Accuracy	±1/4 pixel (±1u m,3.5X Optics)
PR time	20ms
Optics
Microscope	10-30X,2-speed zoom
Power Supply
Voltage	110/220V±5%
Frequency	50/60HZ
Power consumption	800W(Max)
Program Storage Capacity
NO.of programs 99
1000 chips/program
1000 wires/chip
Dimensions and Weight
Weight		280Kg
Size(DxWxH)		760x820x1450mm