MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Weight: 280kg
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
  • MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
  • MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
  • MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
  • MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
  • MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
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Basic Info.

Model NO.
MD-Etech1850g
Transport Package
Wooden Box Packaging
Specification
760x820x1450mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
MD-Etech1850G Full-Auto Ultrasonic Thin Wire wedge Bonder
MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
Feature
With update software suitable for WIN7 OS.
With new computer I5 inside
With new camera and Z system.
*Up to 8 wires/second for 2mm wire
*Strong T-motor ensures the table movement speed
*Applicable for the thin AL wire from 15-50um
*Deep recessed capability up to 3mm by 45° transducer


SPECIFICATION
Bond Head and Table
XYtravel 4"X4"(LED)
θ +/- 360°
Ztravel 0.4"
Resolution 0.02 mil
Bond angle 30°
Wire Size 0.7 mil -2.0 mil
Bond force 15-200gm(programmable)
Bond Power 0-2watt(programmable)
Bond time programmable
Bond head clearance 4.8mm
F/T resolution programmable
Bonding Throughput UPH 14K
( based on 2 mm wire length)
Transducer and Power Unit
Transducer Aluminum alloy light weight type
Power generator Auto-Cal ultrasonic generator
Alignment Reference
Die 0,1 or 2 points
Substrate 0.1 or 2 points
PR System
Programmable search range
XY ±1mm(Magnification 3.5X)
θ ±15"@1"Resolution Satio
Accuracy ±1/4 pixel (±1u m,3.5X Optics)
PR time 20ms
Optics
Microscope 10-30X,2-speed zoom
Power Supply
Voltage 110/220V±5%
Frequency 50/60HZ
Power consumption 800W(Max)
Program Storage Capacity
NO.of programs 99
1000 chips/program
1000 wires/chip
Dimensions and Weight
Weight 280Kg
Size(DxWxH) 760x820x1450mm

MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding MachineMD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding MachineMD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding MachineMD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding MachineMD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding MachineMD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine

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