| Type: | Metal |
|---|---|
| Control Mode: | CNC |
| Voltage: | AC220V |
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Vacuum Eutectic Reflow Soldering Oven System
The design basis of the MDVES400 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.
The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.
The welding porosity can be as low as 1-3% with advanced PID regulation and upper and lower heating systems, with temperature control at around 1 ° C; The welding cycle time is about 8-12 minutes, which can support various process gases such as nitrogen, nitrogen/hydrogen mixture, formic acid, etc; The equipment chamber cover has automatic opening and closing functions.IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.
Application :
IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.
| structure size | |
| Basic frame | 1260*1160*1200mm |
| Maximum height of base | 90mm |
| Observation window | include |
| Weight | 350KG |
| Vacuum system | |
| Vacuum pump | Vacuum pump with oil pollution filtering device optional dry pump |
| Vacuum level | Up to 10Pa |
| Vacuum configuration | 1. Vacuum pump 2. Electric valve |
| Pumping speed control | The pumping speed of the vacuum pump can be set by the host computer software |
| Pneumatic system | |
| Process gas | N2, N2 / H2 (95% / 5%), HCOOH |
| First gas path | Nitrogen/nitrogen-hydrogen mixture (95%/5%) |
| Second gas path | HCOOH |
| Heating and cooling system | |
| Heating method | Radiant heating, contact conduction, heating rate 150ºC/min |
| Cooling method | Contact cooling, the maximum cooling rate is 120ºC/min |
| Hot plate material | copper alloy, thermal conductivity: ≥200W/m·ºC |
| Heating size | 420*320mm |
| Heating device | Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech. |
| Temperature range | Max 450ºC |
| Power requirements | 380V, 50/60HZ three-phase, maximum 40A |
| Control System | Siemens PLC + IPC |
| Equipment power | |
| Coolant | Antifreeze or distilled water ≤20ºC |
| Pressure: | 0.2~0.4Mpa |
| coolant flow rate | >100L/min |
| Water tank water capacity | ≥60L |
| Inlet water temperature | ≤20ºC |
| Air source | 0.4MPa≤air pressure≤0.7MPa |
| Power supply | single-phase three-wire system 220V, 50Hz |
| Voltage fluctuation range | single phase 200~230V |
| Frequency fluctuation range | 50HZ±1HZ |
| Equipment power consumption | about 18KW; grounding resistance ≤4Ω; |
| Host system | including vacuum chamber,main frame, control hardware and software |
| Nitrogen pipeline | Nitrogen or nitrogen/hydrogen mixture can be used as process gas |
| Formic acid pipeline | Bringing formic acid into the process chamber via nitrogen |
| Water cooling pipeline | cooling the upper cover, lower cavity and heating plate |
| Water cooler | Provide continuous water cooling supply to equipment |
| Vacuum pump | Vacuum pump system with oil mist filtration |
| Temperature | 10~35ºC |
| Relative humidity | ≤75% |
| The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals. | |
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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