Semiconductor Device Fabrication Fab Wafer Fab Rie Reactive Ion Etching Failure Analysis Equipment Beol Feol

• After-sales Service: 1 Year
• Certification: CE
• Warranty: 12 Months
• Model NO.: 0
• Automatic Grade: Semiautomatic
• Installation: Vertical
• Driven Type: Electric
• Transport Package: 1300mmx750mmx950mm
• Specification: 1300mmX750mmX950mm
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Product Description

 

Failure analysis equipment

Specification:

1. Prevent chips from flying
2. Minimum node that can be processed: 14nm;
3. SiO2/SiNx etching rate: 50~150 nm/min;
4. Etched surface roughness:<1 nm;
5. Support passivation layer, adhesion layer and back silicon etching;
6. Selection ratio of Cu/Al:>50
7. All-in-one machine LxWxH: 1300mmX750mmX950mm
8. Support one-click execution

Introduction
Applied materials:
Passivation layer: SiO2, SiNx
Backsilicon
Adhesive layer: TaN
Through hole: W

Feature:1. Etching of passivation layer with or without holes; 2. Etching of adhesive layer; 3. Back silicon etching


Specification:
1. Prevent chips from flying
2. Minimum node that can be processed: 14nm;
3. SiO2/SiNx etching rate: 50~150 nm/min;
4. Etched surface roughness:<1 nm;
5. Support passivation layer, adhesion layer and back silicon etching;
6. Selection ratio of Cu/Al:>50
7. All-in-one machine LxWxH: 1300mmX750mmX950mm
8. Support one-click execution

Introduction
Applied materials:
Passivation layer: SiO2, SiNx
Backsilicon
Adhesive layer: TaN
Through hole: W

Feature:1. Etching of passivation layer with or without holes; 2. Etching of adhesive layer; 3. Back silicon etching