Semiconductor Industry Packaging Equipment Automatic Eutectic Patch LED High Precision Die Bonder Die Bonding Die Attach Machine

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MD-JC360
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Crate
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Since 2014,One-stop Professional Solution for 
Semiconductor Front-end and IC TO Package Equipments Line

Automatic die bonder manual upload and down load

MD-JC360: 8inch/12inch  wafer die bonder manual upload and dowload.

Detail:

Factory:
Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.