After-sales Service: | 1 Year |
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Warranty: | 1 Year |
Weight: | 800kg |
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Product description: Automatic wire ball bonder MD-S800
X-Y stage stroke | |
X-Y stroke: | 65*70 mm |
X-Y stage accuracy: | 0.04 mil(1um) |
Z bonder stroke: | 9.0 mm |
Image recognition system and optical system | |
Image recognition method: | 256 grey scale, can recognize R/G/B and matte chips |
Resolution: | 640*480 |
Optical magnification: | 2~4, adjustable |
Optical magnification: | ±0.37 um |
Ultrasonic generator and transducer | |
Ultrasonic generator | UTHE 10H-P2 |
Ultrasonic transducer: | UTHE 70PT |
Temperature controller: | OMRON E5CSL |
User interface: | Windows xp system, Chinese and English language |
Program memory size: | 1000 |
Min golden wire: | 0.5 mil |
Velocity | |
Bonding cycle: | 70ms/2mm wire |
Unit per hour: | 28K (single wire), 15K (dual wire) |
Working condition | |
Voltage/Frequency: | AC220V/50-60Hz |
Compressed air: | ≥0.3~0.5 Bar |
Rated power: | 1200 W |
Gas consumption: | 80 LMP |
Weight and size | |
Weight: | 800 kg |
Size: | 1230mm*940*1660 |