Automatic Dispensing and Placement Machine

• After-sales Service: 1 Year
• Warranty: 1 Year
• Model: Mdrbdb06-0203-10
• Model NO.: MDRBDB06-0203-10
• Dimension: 1600X1300X1700(mm)
• Weight: 1200kg
• Power: 8kw
• Air Pressure: 0.4~0.6MP
• Transport Package: 1600X1300X1700(mm)
• Specification: 1600x1300x1700(mm)
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description

 

Product description: MDRBDB06-0203-10 Automatic dispensing and placement machine

Dimension:
X 1600mm
Y 1300mm
Z 1700mm
1,Equipment structure
Include:
1,Glue tray 
2,Dispensing robot arm
3,Surveillance camera
4,Base positioning CCD1
5,Chip patch robot
6,Chip front calibration CCD2
7,Chip picking robot
8,Chip wafer CCD3
9,Chip wafer(TRAY)assembly
10,Thimble assembly
11,Chip calibration workbench
12,Base fixture table
2,Device principle function
MDRBDB06-0203-10 is a production equipment for bonding substrates and chips to a COB/COC process through a dispensing process.
Manual loading section:
The substrate is manually placed on the substrate fixture, and the substrate fixture is placed on the substrate table to be fixed.;
Automatic patch section:
After the device is started, the substrate table moves, and the substrate is moved under the CCD1. After the camera is recognized, the system feeds back the information, and the substrate table performs position compensation, which is the accurate position of the substrate;The dispensing manipulator dips glue on the glue tray, then moves over the base and carries out dispensing, then leaves and dips glue to prepare for the next dispensing action;At the same time of dispensing, the chip picking robot picks up a chip on the chip wafer and places it on the nozzle of the calibration workbench,After the CCD2 is recognized, the calibration workbench performs position compensation in the XY and directions. The chip placement robot accurately picks up the chip and moves it to the substrate. The chip is applied with a certain pressure to make the chip and the substrate firm. Contact and locate.After the completion of the solid crystal, the apparatus performs the next cycle until the patch solid crystal process of the plurality of substrates of the entire substrate fixture is completed.
3,Overview of major components
Robot and dispensing system
The robot can achieve precise displacement in the three directions of X, Y and Z.
The nozzle of the robot adopts the bakelite nozzle to avoid damage to the wafer, and the base nozzle can realize the rotational positioning. The pressure of the nozzle nozzle is controlled in the range of 10g to 50g.
The dispensing system uses a dispensing structure similar to ASM, which allows for a good control of dispensing.
Overview of major components
Chip wafer(tray)assembly It contains crystal ring fixer, thimble assembly, XY worktable.
Overview of major components
Robot Arm It can realize XYZ three-axis linkage,  the nozzle has a buffer function, 
and realizes mechanical pressure control, the pressure range is 10~50 grams.  Vacuum and blow control.
Overview of major components
Chip calibration workbench It can realize XYZ three-axis linkage,  and has a chip adjustment mechanical  mechanism to ensure the imaging of the chip, which is convenient for the CCD system to identify and locate, and a chip recycling device is  also arranged at the edge. Base table With XY platform structure, table travel range: X200,Y300.The base fixture is easy to assemble.
CD vision system
The equipment uses industrial cameras to identify and locate products to improve 
the packaging accuracy of the products. A total of 6 sets of vision components are 
used, each of which includes industrial cameras, lenses, and LED light sources.
Dispensing system
Rotating glue tray, flat scraper to maintain the amount of glue. The amount of dispensing 
is controlled by adjusting the thickness of the scraper;
The dispensing head assembly is placed on Dispensing head assembly 
the X, Y, Z working arms for easy position setting.
4,Device parameters

Dimension:	1600x1300x1700(mm)
Weight:	1200KG
Power:	8KW
Air pressure:	0.4~0.6MP
Voltage:	220W
Positioning accuracy:	±10µm
Angle accuracy:	±1°
UPH:	2000/H
Solid crystal pressure:	10~50g
Wafer size:	6"(tray   2"X2")
Base table travel size:	X200-Y300
Chip size:	0.2~1mm

FAQ
1. who are we?
We are based in Guangdong, China, start from 2014,sell to North America(00.00%),Western Europe(00.00%),South Asia(00.00%),Southeast Asia(00.00%),Mid East(00.00%),South America(00.00%),Eastern Asia(00.00%),Northern Europe(00.00%). There are total about 11-50 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3.what can you buy from us?
Soldering machine,Precision spot welding machine,Plasma cleaning machine,Glue dispenser,Screw machine

4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.

5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,FCA,CPT;
Accepted Payment Currency:USD,EUR,HKD,CNY;
Accepted Payment Type: T/T,PayPal,Cash;
Language Spoken:English,Chinese