MD-S Series Automatic Semiconductor Wire Ball Bonder

• After-sales Service: 1 Year
• Warranty: 1 Year
• Weight: 750kg
• Model NO.: MD-S808 / MD-S838
• Bonding Capability: 48ms/W(2mm Wire Length)
• Bongding Speed: +/-2ym
• Wire Length: Max 8mm
• Transport Package: 950*920*1850mm
• Specification: 950*920*1850mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description

 

Product description
MD-S series automatic semiconductor wire ball bonder

speed:21W/S for 2mm
Welding line area:56*80mm
Leadframe width:28-90mm
application
IC(SOP,SOT,DIP,BGA,COB.)
LED(SMD,COB)
advantage:
Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption
The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution
0.1um,+/-2um(High resolution 0.1um worktable, + / - 2um welding line accuracy EFO(High resolution EFO Full closed loop force control
2.5mil(2.5mil copper wire Optional Automatic conversion of product types

(Specification)
(Bonding Capability)	48ms/w(2mm Wire Length)
(Bongding Speed)	+/-2Ym
(Wire Length)	Max 8mm
(Wire Diameter)	15-65ym
(Wire Type)	Au,Ag,Alloy,CuPd,Cu
(Bonding Process)	/BSOB/BBOS
(Looping Control)	(Ultra Low Looping)<50ym
(Bonding Area)	56*80mm
XY(XY Resolution)	0.1ym
(Ultrasonic Frequence)	138KHZ
(PR accuracy)	+/-0.37ym
(Applicable Magazine)
(L)	120-305mm
(W)	36-98mm
(H)	50-180mm
(Pitch)	Min 1.5mm
(Applicable Leadframe)
(L)	100-300mm
(W)	28-90mm
(T)	0.1-1.3mm
(Conversion Time)
(Different Leadframe)	<15min
(Same Leadframe)	<4min
(Operation Interface)
(MMI Language)	(Chinese,Enghise)
(Dimension, Weight)
(Overall Dimension)W*D*H	950*920*1850mm
(Weight)	750KG
(Facilities)
(Voltage)	190-240V
(Frequency)	50Hz
(Compressed Air)	6-8Bar
(Air Consumtion)	80L/min