Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522

Product Details
Type: Bonder
Control Mode: Auto
Voltage: AC220V
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
  • Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
  • Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
  • Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
  • Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
  • Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
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  • Overview
  • Product Description
  • Detailed Photos
Overview

Basic Info.

Model NO.
MDZWSQB-1522
Bonding Area
X*Y:150*225mmz:50mm
Theta Rotation
-360°~360°
Placement Precision
±3um@3s ±0.00018°@3s
Bond Force
1-300g Precision0.1g Programmable
Deep Access
Compatible 16/19mm Capillary
Uph
2~7 Wire Per Second
Specification
800kg
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090

Product Description

Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522

MDZWSQB-1522
Auto Fine Wire Ball Bonder
Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522
Product Description

 

Features
1. Constant Loop Height, Constant LoopLength,Increase the Looping Consistency.
2. Continuous real time monitoring and controlling of wire deformation
3. Optimized PR especially on LTCC/HTCC
4. Bump/BSOB/BBOS.

Product advantages
Adaptability 1-High efficient transducer,more reliable quality ofbond;
2-Table tear and Clamp tear;
3-Sectionalized bonding parameter, for the different interface;
4-Multi sub-program to be combined;
5-SECS/GEM protocol;
Stability 6-Real time detection of wire deformation
7-Real time detection of ultrasonic power;
8-Second display screen;
Consistency 9-Constant loop height,loop length;
10-online BTO for wedge tool calibration by uplook video.

Parametric Metrics
Bonding Area X*Y:150*120mm(Inline)150*225mm(Fixed workholder)Z:50mm
Theta rotation -360°~360°
Placement precision ±3um@3S ±0.00018°@3S
Bond force 1-300g precision0.1g programmable
Wire Au wire:12-75um,Al wire:20- 100um
Ribbon Au ribbon 25*12.7μm-250*25.4μm
Deep Access Compatible 16/19mm capillary
EFO 0~100mA,0~4000us programmable multi-Profile mode
UPH 2~7 wire per second
 
Detailed Photos

 

Product details______________________________________________________ 
Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522


Sample_____________________________________________________________
Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522Automatic Deep Access Ball Bonder for Microwave Product Mdzwsqb-1522

Product maintenance
Technical Services
There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours.

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