Vertical Grinder Wafer Back Grinder Mdfd-320

• Specification: 1125*2000*1750mm
• Trademark: minder-hightech
• Origin: Guangzhou
• Model NO.: MDFD-320
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description
Vertical grinder MDFD-320
It is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the
granularity(roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.

This machine is very easy for operator.
Application
Mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) .

Specification:

Sucker(chucktable)	D320-D600	Main motor	2.2kw 0-280RPM
Grinding wheel	D150-D200	Feed motor	750w
Workpiece Thickness b	0.8<=b<=50mm	Spindle	4kw/3000-8000RPM
Flatness	+-2um(50*50)	Sand pump motor	250w
Best workpiece diameter	D50	Grating system	0.001mm
Location accuracy	3um	Dimension	1125*2000*1750mm
Working station	depending	Weight	700kg
air source	0.6mpa	power	380v*3

sample
Factory
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