High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use

Product Details
After-sales Service: 1 Year
Condition: New
Speed: High Speed
Diamond Member Since 2017

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  • High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
  • High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
  • High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
  • High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
  • High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
  • High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
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Basic Info.

Model NO.
MDSJHYZP0225
Precision
Precision
Certification
CE
Warranty
12 Months
Automatic Grade
Manual
Type
High-speed Chip Mounter
Trademark
minderhightech
Origin
China
Production Capacity
1000

Product Description

Manual Epoxy die bonder

Model: MDSJHYZP0225
High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
 

Features:

1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc.

2. Realize the soft contact of the suction nozzle, effectively solve the problem of the active area such as the air bridge on the surface of the GaAs chip

3. Non-damage flattening adjustment for uneven patch or large-sized chips

4. Dispensing and patch are integrated, integral, convenient or double-head patch function, improve efficiency
High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use

Product advantages:

Function:

Automatic scribing, dispensing, sticking

Bonded Chip Size:

0.2-25mm

Adhesive pressure:

10-150g

Lifting table size:

X-Y:250*270mm Z:18m

Control platform effective travel:

X-Y:10mm*10mm Z:25mm

Motion Control Platform Accuracy:

0.2um

Nozzle rotates 360°

Chinese self-naming parameter file name storage, easy to remember

With automatic height detection function

Later upgradeable epoxy eutectic machine

 

Product maintenance:

Parameters

power supply:

AC220V±10%,50-60HZ,≤400W

Compressed air>=0.5MPa

Vacuum pipeline <-0.08MPa

External dimensions:

800*380*450mm

weight:

70KG

stable workbench keep away from vibration sources

High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use
Echnical Services:

There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed

More than 5 years of domestic technical service experience on similar equipment

After-sale warranty

1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years

Respond within 12 hours, arrive at the scene within 72 hours


High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory UseHigh Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use

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