After-sales Service: | 1 Year |
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Warranty: | 1 Year |
Type: | Stone Grinding Machine |
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Model | MDTS-WT2200 |
Number of thinning axes | 2 |
Number of workbenches | 3, Index method |
Grinding wheel spindle | Number of air spindles: 2 Spindle motor: 7.5kW variable frequency motor Speed: 0~6000rpm, steplessly adjustable Grinding wheel specification: Φ203mm Grinding wheel type: diamond grinding wheel |
Grinding wheel feeding system | Quantity: 2 sets Feed system control method: LM guide rail and ball screw combination Drive motor: servo motor Minimum feed speed: 0.1um/sec Maximum feed speed: 50mm/sec |
Workbench | Quantity: 3, Index mode Spindle motor: Servo motor Speed: 0~300rpm, steplessly adjustable Adsorption method: Vacuum adsorption |
Workbench turntable | Drive mode: servo motor Rotation range: 0~240° Positioning shape: sensor assisted positioning |
Automatic thickness measurement system |
Measurement method: IPG contact online real-time measurement Number of measuring heads: 2 Measuring sensor: 0.1um level sensor |
Automatic loading/ unloading system |
Box type: 6-8inch Cassette, 25 layers Automatic loading/unloading method: wafer manipulator is used to ensure thin wafers are transported without damage Wafer thickness: 150um-1000um |
Workbench cleaning function | Cleaning method: Oilstone polishing &DI water+air two-fluid flushing |
Automatic cleaning/ drying system |
Cleaning: DIW nozzle cleaning Drying method: Blowing +drying Speed: max1000rpm steplessly adjustable |
Static elimination system | Ion bar orion fan |
Spindle chiller | Temperature: 18-22°C Flow rate: 4~8L/min |
Control system | Control system: PCcontrol system, touch screen 3-coloralarm light Chinese/English human-machineinterface |
Maximum wafer size | Maximum compatible with 8 inches |
Speed range | 0~6000 RPM |
Z-axis travel | 160mm |
Z-axis feed speed | 0.1~100um/sec |
Z-axis fast retract speed | 50mm/sec |
Z-axis resolution | 0.1um |
Online thickness measurement range | 0~1800um |
Online thickness measurement resolution | 0.1um |