Mdts-Wt2200 Fully Automatic Wafer Thinning Machine

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Stone Grinding Machine
Diamond Member Since 2017

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Registered Capital
1000000 RMB
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Basic Info.

Model NO.
MDTS-WT2200
Control
CNC
Automation
Automatic
Precision
High Precision
Type for Grinding Machine
Special Grinding Machine
Grinding Machine Type
Barrel Polishing Machine
Grinding Method
Wet Grind
Condition
New
Trademark
minder-hightech
Origin
China
Production Capacity
1000

Product Description

MDTS-WT2200
Fully Automatic Wafer Thinning Machine
Mdts-Wt2200 Fully Automatic Wafer Thinning Machine
Features:

1.Excellent compatibility:Maximum8-inch compatibility
2.Operation mode:Fully automatic mode processing
3.Automaticmode fordrying inand out, with cleaning and drying functions
4.Using specialized grinding wheels
5.Equipped with wheel overload waiting function


Technical parameters:
Model MDTS-WT2200
Number of thinning axes 2
Number of workbenches 3, Index method
Grinding wheel spindle Number of air spindles: 2
Spindle motor: 7.5kW variable frequency motor
Speed: 0~6000rpm, steplessly adjustable
Grinding wheel specification: Φ203mm
Grinding wheel type: diamond grinding wheel
Grinding wheel feeding system Quantity: 2 sets
Feed system control method: LM guide rail and ball screw
combination
Drive motor: servo motor
Minimum feed speed: 0.1um/sec
Maximum feed speed: 50mm/sec
Workbench Quantity: 3, Index mode
Spindle motor: Servo motor
Speed: 0~300rpm, steplessly adjustable
Adsorption method: Vacuum adsorption
Workbench turntable Drive mode: servo motor
Rotation range: 0~240°
Positioning shape: sensor assisted positioning
Automatic thickness
measurement system
Measurement method: IPG contact online real-time measurement
Number of measuring heads: 2
Measuring sensor: 0.1um level sensor
Automatic loading/
unloading system
Box type: 6-8inch Cassette, 25 layers
Automatic loading/unloading method: wafer manipulator is used to ensure thin wafers are transported without damage
Wafer thickness: 150um-1000um
Workbench cleaning function Cleaning method: Oilstone polishing &DI water+air two-fluid  flushing
Automatic cleaning/
drying system
Cleaning: DIW nozzle cleaning
Drying method: Blowing +drying
Speed: max1000rpm steplessly adjustable
Static elimination system Ion bar orion fan
Spindle chiller Temperature: 18-22°C
Flow rate: 4~8L/min
Control system Control system: PCcontrol system, touch screen 3-coloralarm light
Chinese/English human-machineinterface
Maximum wafer size Maximum compatible with 8 inches
Speed range 0~6000 RPM
Z-axis travel 160mm
Z-axis feed speed 0.1~100um/sec
Z-axis fast retract speed 50mm/sec
Z-axis resolution 0.1um
Online thickness measurement range 0~1800um
Online thickness measurement resolution 0.1um

 

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