After-sales Service: | 1 Year |
---|---|
Warranty: | 1 Year |
Type: | Stone Grinding Machine |
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Grindable wafer | Size | Inches | 4,5,6,8 |
Wafer cassette | Number | - | 2 |
Rubbing way | - | Vertical plunge grinding method | |
Grinding wheel spindle | Types | - | Air bearings |
Quantity | - | 2 | |
Speed | rpm | 0~5000 | |
Output Power | Kw | 5.5/7.5 | |
Stroke | mm | 150 | |
Feed Speed | um/s | 0.01~100 | |
Fast forward speed | mm/min | 300 | |
Resolution | um | 0.1 | |
Workpiece axis | Type | - | Ball bearings |
Quantity | - | 3 | |
Suction cup type | - | Microporous ceramics | |
Wafer suction method | - | Vacuum adsorption | |
Speed | rpm | 0~300 | |
Wafer transfer | - | Robot arm | |
- | Revolving disk | ||
Other functions | Wafer centering | - | Mobile pin alignment |
Wafer cleaning | - | Water and air cleaning,spin drying | |
Suction cup cleaning | - | Oilstone cleaning | |
Grinding wheel | mm | Φ200 | |
Online measurement |
Measurement range | um | 0~1800 |
Resolution | um | 0.1 | |
Repeat accuracy | um | ±0.5 | |
Machining accuracy |
Intra-wafer accuracy (TTV) | um | ≤2 |
Inter-wafer accuracy (WTW) | um | ±3 | |
Surface roughness (Ry) | um | 0.13(2000#finish) | |
Appearance | Appearance coloring | um | Orange Pattern |
Dimensions(W×D×H) | mm | 1200×2750×1950 | |
Weight | kg | 4200 |