Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Stone Grinding Machine
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine
  • Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine
  • Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine
  • Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine
  • Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine
  • Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine
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Basic Info.

Model NO.
MDXZ-G200HG
Control
CNC
Automation
Semi-automatic
Precision
High Precision
Application
Wafer
Type for Grinding Machine
Special Grinding Machine
Grinding Machine Type
Vibration Polishing Machine
Grinding Method
Wet Grind
Certification
CE
Condition
New
Transport Package
Wooden Case
Trademark
MH
Origin
China
Production Capacity
1000

Product Description

MDXZ-G200HG Semi Automatic Wafer Grinder

Semi automatic single axis wafer back thinning

Grindable wafer size 4-8 "
Single axis single disc mode
Online thickness measurement
Corresponding to irregular specifications

Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine

Capable of processing irregular shaped products
Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine

Parameters
Grindable wafer Size Inches 4,5,6,8
Rubbing way   - Vertical plunge grinding method
Grinding wheel spindle Types - Air bearings
Quantity - 1
Speed rpm 0~5000
Output Power Kw 5.5/7.5
Stroke mm 150
Feed Speed um/s 0.01~100
Fast forward speed mm/min 300
Resolution um 0.1
Workpiece axis Type - Ball bearings
Quantity - 1
Speed rpm 0~300
Power kw 0.75
Suction cup type - Microporous ceramics
Wafer suction method - Vacuum adsorption
Wafer transfer   - Manual
Other functions Wafer centering - -
Wafer cleaning - -
Suction cup cleaning - -
Grinding wheel   mm Φ200
Online
measurement
Measurement range um 0~1800
Resolution um 0.1
Repeat accuracy um ±0.5
Machining
accuracy
Intra-wafer accuracy (TTV) um ≤2
Inter-wafer accuracy (WTW) um ±3
Surface roughness (Ry) um 0.1(2000#finish)
Appearance Appearance coloring um Orange Pattern
Dimensions(W×D×H) mm 690×1720×1780
Weight kg 1400

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Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding MachineSemiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding MachineSemiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding MachineSemiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Semiconductor Device Fabrication Fab Wafer Thinning Polishing Mdxz-G200hg Semi Automatic Wafer Grinder Grinding Machine

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