After-sales Service: | 1 Year |
---|---|
Function: | Wafer Optical Inspect |
Demoulding: | Automatic |
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Project | Content |
Product Type | 6",8",12" wafer, 2.5D/3D packaging |
2D Inspection Items |
Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc. |
2D Metrology | Bump diameter, needle mark coordinates, RDL and TSV metrology, etc. |
3D Inspection Project | Bump height, Bump coplanality |
Cassette &Transmission Method | 8"SMIF , 12" FOUP or combination |
Lens and Resolution | 2x(2.75um)13.5x(1.57um)5x(1.1um)17.5x(0.73um)110x(0.55um) |
Precision | 0.55um/pixel |
Optional and Customized | Double sided OCR,3D module, supported by E84 |