Customized High Precision Wafer Bonding Machine Die Bonder

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Precision: High Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Trademark: MH
• Origin: China
• Production Capacity: 1000

Product Description

Customized High Precision Wafer Bonding Machine Die bonder
This model is a chip placement machine designed specifically for high-precision optical modules, optical components, sensors, and various high-precision IC packaging flip chips.

High speed solidification machine, composed of multiple subunit modules:
1, Direct drive rotating solid crystal bonding head, 180 ° swing arm rotation with linear bonding head.
2, Multi pin design for easy adaptation to different types and sizes of wafer chips.
3, 1.3 million resolution visual system for positioning chips and frames.
4, Servo controlled precision dispensing system, capable of drawing glue.
5, Automatic magazine feeding and receiving.
6, Solid crystal worktable module, using linear motor and high-precision grating ruler.
7, Crystal rings are suitable for 12 inch, 8-inch, and 6-inch iron ring wafers.

Structure Introduction:
Equipment dispensing:

Glue dispensing and drawing interface: simple and convenient operation, multiple commonly used glue drawing methods.
Equipment glue effect:

Multiple visual algorithm applications:
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.