Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
International Commercial Terms(Incoterms):
EXW
Wire Bonder, Soldering Machine, Bond Tester manufacturer / supplier in China, offering LED Tec Wafer Packaging Equipment High Precision Chip Bonding Eutectic Die Bonder, Automatic to Laser Tube Wire Bonder / Auto Deep Access Wire Bonding Machine, Semiconductor IC / to Package Machine Automatic Die Attach Die Bonder Bonding Machine and so on.
Diamond Member
Audited Supplier
