Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine

Product Details
Style: Floor
Control: Automatic
Application: Auto Industry
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  • Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
  • Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
  • Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
  • Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
  • Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
  • Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
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Basic Info.

Model NO.
MDZC-1000
Trademark
minder-hightech
Origin
China

Product Description

Wafer level
Solder ball placement machine
MDZC-1000
Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
Laser solder ball placement (soldering) technology can be applied to both lead and lead-free solder balls; Such as SnPb (lead tin), AuSn (gold tin), AgSn (silver tin), SnAgCu (tin silver copper), etc.
Laser tin ball placement(soldering)  technology can achieve tin ball welding with a minimum diameter of 60um and a maximum diameter of 2000um. According to customer products and requirements, there are multiple tin ball diameters to choose from.
Now, we already mass product 70um ball to wafer placement, and min60um for R&D usage.

Character:
1,Small footprint (length x width=1200mm x 1300mm)
2,Equipped with safety grating to protect the safety of operators
3,Marble base, stable structure, guaranteed accuracy/speed
4,Optional standard tin ball diameter 250um-750um (one specification per 50um)
5,Optional microspheres (diameter 70um-200um)/large balls (diameter 800um-2000um); Need to confirm in advance
6,Independently developed software, easy to operate and quick to get started
7,The laser has a long lifespan, and imported lasers are used, with a lifespan of up to 100000 hours
8,Configure a laser power feedback system to achieve precise control of the laser
Mdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement Machine
Principle:
Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
Mdzc-1000 Wafer Level Laser Solder Ball Placement Machine
Part of photos:
Mdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement Machine

Product Details:

Mdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement MachineMdzc-1000 Wafer Level Laser Solder Ball Placement Machine

Frequently Asked Questions:

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

 

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