Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine

Product Details
After-sales Service: 1 Year
Function: Microwave Plasma
Demoulding: Automatic
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
  • Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
  • Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
  • Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
  • Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
  • Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
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Basic Info.

Model NO.
SPMV-100HT
Condition
New
Certification
CE
Warranty
18 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Crate
Specification
1300*2100*1200mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Microwave Plasma Cleaning Machine
 
For semiconductor chip bonding pre-processing, plastic packaging pre-processing, photoresist removal, metal bonding and pre-processing.

Product introduction:
This is a low voltage microwave plasma cleaning system for semiconductors. By applying microwave with the frequency of 2.45GHz to the window on the wall of the vacuum cavity, a large number of continuous Plasma is generated, and the chip is cleaned by entering the cavity.

Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
Advantages:
1. Plasma is uncharged and will not cause damage to circuits
2. Keep the temperature low during the treatment process
3. Fast response speed and short reaction time
4. No electrodes, no pollution sources, long life
5. Able to maintain plasma under high pressure
6. Microwave junctions and magnetic circuits are compatible
7. Low self-bias voltage requirements
8. The high voltage source and generator are isolated from each other for safety

Application areas:
Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
Dual power supply technology Microwave+Bias RF:
Microwave achieves excellent stripping rate and uniformity (photoresist stripping) characteristics, radio frequency bias provides directional kinetic energy for plasma movement, and dual power supply technology improves the efficiency and effect of semiconductor stripping and etching.
Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
Technical parameters:
Vacuum plasma host
Equipment size 1230X1800X1100mm (width x height x depth)
Weight 450kg
Power demand AC380V, 50/60Hz, 5-wire, 30A
Plasma generator specifications
Microwave power supply Power 0~1250W
Frequency 2.45GHz
Vacuum system
Material Aluminum alloy (customizable stainless steel chamber)
Thickness 25mm
Internal dimensions of the cavity 480mmX470mmX480mm
Workspaces 6 magazine sections
ECR Slotted Magazine provides ECR enhanced processing effect
Plasma capability
Processing ability 35um Pitch
40μm Bump
15X15mm Maximum Die size

Equipment details:
Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma MachineSemiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma MachineSemiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma MachineSemiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine
Semiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma MachineSemiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma MachineSemiconductor Equipment Chip Bonding Pre-Processing Photoresist Remove Residual Wafer Cleaning Wafer Cleaner Chip Packaging Processing Microwave Plasma Machine

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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