Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon

Product Details
After-sales Service: 1 Year
Function: Wire Bonder
Demoulding: Wire Bonder
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
  • Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
  • Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
  • Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
  • Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
  • Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
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Basic Info.

Model NO.
MH
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Trademark
mh
Origin
China
Production Capacity
1000

Product Description

IC/TO Package Line

Automatic Wire Bonder


Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
Partial samples:

Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon
Factory shooting:
Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon

Machine Details:
Semiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment SemiconSemiconductor Manufacturing Ball Wedge Bonding Wire Bonder Wire Bonding Machines Equipment Semicon


Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

 

(Specification)

(Bonding Capability)

48ms/w(2mm Wire Length)

(Bongding Speed)

+/-2Ym

(Wire Length)

Max 8mm

(Wire Diameter)

15-65ym

(Wire Type)

Au,Ag,Alloy,CuPd,Cu

(Bonding Process)

/BSOB/BBOS

(Looping Control)

(Ultra Low Looping)<50ym

(Bonding Area)

56*80mm

XY(XY Resolution)

0.1um

(Ultrasonic Frequence)

138KHZ

(PR accuracy)

+/-0.37um

(Applicable Magazine)

(L)

120-305mm

(W)

36-98mm

(H)

50-180mm

(Pitch)

Min 1.5mm

(Applicable Leadframe)

(L)

100-300mm

(W)

28-90mm

(T)

0.1-1.3mm

(Conversion Time)

(Different Leadframe)

<15min

(Same Leadframe)

<4min

(Operation Interface)

(MMI Language)

(Chinese,Enghise)

(Dimension, Weight)

(Overall Dimension)W*D*H

950*920*1850mm

(Weight)

750KG

(Facilities)

(Voltage)

190-240V

(Frequency)

50Hz

(Compressed Air)

6-8Bar

(Air Consumtion)

80L/min


 

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