Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder

Product Details
After-sales Service: 1 Year
Function: Wire Bonder
Demoulding: Wire Bonder
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
  • Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
  • Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
  • Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
  • Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
  • Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
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Basic Info.

Model NO.
MH
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Trademark
mh
Origin
China
Production Capacity
1000

Product Description

IC/TO Package Line

Automatic Wire Bonder


Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
Partial samples:

Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder
Factory shooting:
Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder

Machine Details:
Semiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire BonderSemiconductor Semi-Auto High Precision High Speed Ball Wire Bonding Machines Wire Bonder


Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

 

(Specification)

(Bonding Capability)

48ms/w(2mm Wire Length)

(Bongding Speed)

+/-2Ym

(Wire Length)

Max 8mm

(Wire Diameter)

15-65ym

(Wire Type)

Au,Ag,Alloy,CuPd,Cu

(Bonding Process)

/BSOB/BBOS

(Looping Control)

(Ultra Low Looping)<50ym

(Bonding Area)

56*80mm

XY(XY Resolution)

0.1um

(Ultrasonic Frequence)

138KHZ

(PR accuracy)

+/-0.37um

(Applicable Magazine)

(L)

120-305mm

(W)

36-98mm

(H)

50-180mm

(Pitch)

Min 1.5mm

(Applicable Leadframe)

(L)

100-300mm

(W)

28-90mm

(T)

0.1-1.3mm

(Conversion Time)

(Different Leadframe)

<15min

(Same Leadframe)

<4min

(Operation Interface)

(MMI Language)

(Chinese,Enghise)

(Dimension, Weight)

(Overall Dimension)W*D*H

950*920*1850mm

(Weight)

750KG

(Facilities)

(Voltage)

190-240V

(Frequency)

50Hz

(Compressed Air)

6-8Bar

(Air Consumtion)

80L/min


 

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