Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine

Product Details
After-sales Service: 1 Year
Function: Laser Open
Demoulding: Laser Open
Diamond Member Since 2017

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  • Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
  • Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
  • Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
  • Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
  • Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
  • Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
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Basic Info.

Model NO.
MDHA-LO1520
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Trademark
mh
Origin
China
Production Capacity
1000

Product Description

MDHA-LO1520
Laser vision cap opener
Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening MachineProduct Overview
1. Manually programmable path. After chip packaging, the workpiece cover can be automatically, quickly, and accurately opened, allowing for secondary and multiple chip packaging.
2. The device is easy to operate and has high reliability. Its opening is non-destructive and can be used for re sealing after repair, hence it is also known as a metal opening machine or non-destructive repair opening machine.

Operating principle
1.Using auxiliary vision combined with laser AI for height and horizontal correction, there will be no issues during work Due to issues with the material itself, there may be cutting errors, ensuring that after opening the lid, it is 100% non reusable and does not affect aesthetics.
2.By using the camera to recognize the size feedback program, the laser positioning correction is performed after the program is executed, and the correction is carried out while tracking during the work process.
Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening MachineSemiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
Application Devices
1. Used for ceramic packaging, metal packaging of rectangular, circular, polygonal, anisotropic optoelectronic devices, thick film circuits, optical communication devices, quartz crystal oscillators, etc.
2. Commonly used for precise opening and sealing of various packaging forms such as parallel sealing technology, laser sealing technology, energy storage welding technology, etc.
Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine

Key points
1.Imported high speed spindle motor, speed up to 30000rpm, beating small.
2.Laser alignment and laser height measurement ensure milling cutter accuracy ±3μm.
3.One powerful opening or multiple flexible opening can be selected, the open cover surface ±5μm, uniform and no residue.
4.Powerful spindle system automatic cleaning treatment +professional dust dual guarantee operation without debris.

Technical features
1.Open milling and feed along the contour line to separate the cover plate from the workpiece.
2.Origin directly set, reset function.
3.Software virtual processing, can preview the processing path.
4.Real-time processing path and progress display.
5.Laser ranging to determine the depth of the knife depth.
6.Automatic vacuum.
7.The spindle speed can be adjusted according to the tool and product.

Technical parameters
Model MDHA-LO1520
Table Stroke 205mm×245mm
Maximum Cover Size 150mm×200mm
Cover Accuracy ±5μm
Laser Positioning Accuracy ±3μm
Laser Measurement Accuracy ±3μm
Feed Depth 0.01mm-5mm(Adjustable)
Feed Width 0.1mm-4mm
Alignment Mode CCD(MARK Point recognition)
Maximum Speed 30000rpm
Maximum Moving Speed 10mm/s
Drive Mode X,Y,Z axis private motor
Dust Handling Built-in cleaning device
Communication Interface HDMI interface
Computer System Built-in Industrial Computer
Operating System WindowsXP/Vista/Win 7
Output Voltage Exchange(220±22)V,(50±1)Hz(Customizable110V)
Total Equipment Power 1.5KW
Machine Weight 90KG
Overall Dimensions (L)800mm×(W)700mm×(H)900mm

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

Semiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening MachineSemiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening MachineSemiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening MachineSemiconductor Secondary Packaging Equipment Wafer Chip Laser Vision Cap Opener Non Destructive Repair Cover Opening Machine
Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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