Semiconductor IC to LED Package Equipment Wire Bonder Wire Bonding Machine

• After-sales Service: 1 Year
• Function: Wire Bonder
• Demoulding: Wire Bonder
• Model NO.: MH
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000
• Package Size: 120.00cm * 100.00cm * 130.00cm
• Package Gross Weight: 800.000kg

Product Description

All equipment needs to be customized according to your samples. Please consult our sales engineers for details.

Since 2014, Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 

MD-S series automatic semiconductor wire ball bonder

MDZWSQB-1522 Auto deep access Wire Ball Bonder

Advantage:

Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption.

The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution.

High resolution 0.1um worktable, + / - 2umwelding line accuracy.

High resolution EFO.

Full closed loop force control.

2.5mil copper wire.

Optional Automatic conversion of product types.

Features:

1. Constant Loop Height, Constant LoopLength,Increase the Looping Consistency.

2. Continuous real time monitoring and controlling of wire deformation

3. Optimized PR especially on LTCC/HTCC

4.Bump/BSOB/BBOS.

MD-Etech1850 Automatic Wire Wedge Bonder

Semi-automatic and manual advanced wire bonder

MD-ETECH1850 automatic ultrasonic wedge bonder using servo system, 4"*4" working stroke, can suitable for diversification LED products. Sealed clean ultra-silent working table provides a good working environment. With technical innovation, precision and capacity are improved obviously. The high technology, high precision, high accuracy pointing system can offer a more excellent production scheme with good capacity and quality. Operate with Chinese and English menu, friendly user interface.

MD-Etech1850G is upgrade version which suit for win7 and faster response team.

Features:

1. Fixed arc height, fixed line length, automatic arc starting, improve line arc consistency;

2. Real-time monitoring of solder joint deformation, effectively guaranteeing the quality of bonding solder joints;

3. Manual/semi-automatic function online switching, flexible and convenient, better product compatibility;

4. Ball planting wireless tail/BSOB/BBOS/adding ball position/pad ball position can be set online, automatic point alignment;

5. Ball welding and wedge welding are integrated, convenient and fast switching.

MDAWB-4NL400 Automatic Wire Bonder 

MDB-2575 Manual Wire Bonder

This street light features high brightness, energy saving, environmental protection, and easy installation. It has a waterproof rating of IP67 and has passed CE certification. It is suitable for schools, parks, roadsides, factories, squares, etc. It has a warranty period of 3 years. Moreover, we can provide various styles to meet your needs.

Application:
Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.
Specification

MD-KTO94 Automatic TO Laser Tube Wire Bonder

MD-BT104 Multifunctional Pull tester for Wire Bonding Test

1. The machine is suitable for TO56 laser diode packaging

For TO56 laser diode vertical and side welding, automatic loading and unloading welding equipment.

2. High compatibility

Welding TO56 laser diode, long and short pin compatible. Front side welding.

3. High stability

Bangtou adopts the optical deletion ruler imported from Germany and the most advanced voice coil motor, the welding action is high speed and stable.

4. High processing speed

Welding cycle: 80ms/W

MD-BT104 The multifunctional push-pull testing machine is widely used in applications such as LED packaging testing, IC semiconductor packaging testing, TO packaging testing, IGBT power module packaging testing, optoelectronic component packaging testing, automotive, aerospace,  product testing, research institutions' testing, and various universities' testing and research.

Equipments Real Shot

Some of Sample

Packaging & Shipping

Company Profile

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 

Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

We are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.

Our main products include: Die bonder, Wire bonder, Wafer grinder, Dicing saw, Plasma surface treatment, Photoresist removing machine, Rapid Thermal Processing, RIE, PVD, CVD, ICP, EBEAM, Parallel sealing welder, Terminal insertion machine, capacitor winding machine, Bonding tester, etc.

Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

 

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

 

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

 

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

 

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

 

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

 

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.