After-sales Service: | 1 Year |
---|---|
Function: | Wire Bonder |
Demoulding: | Automatic |
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model | CT2300 | CT3000 | CT3100A |
Z stroke | 0.4" | ||
Resolution | 1μm | ||
Wire feeding degree | 30° | 30° (45° optional) | |
Wire diameter | 1.0-2.0 MIL | 0.8-2.0 MIL | 1.0-2.0 MIL |
Bonding force | 15-80 gm | ||
Bonding power | 0-2W adjustable | ||
Bonding time | adjustable | ||
Distance between | 4.8 mm | ||
Bonding head and base | Work stage | ||
XY stroke | 2"*2" | 2"*2" | 3"*3" |
Rotary range | No limit | ||
Base dimension | Max rotary R: 380mm | ||
transducer | Light weight aluminum alloy | ||
Process scan range XY | ±1mm (Magnification 3.5 times) | ||
Process scan range rotary | ±15° | ||
Optical system | 2.5X process control | ||
Storage | Up to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chip | ||
Voltage | 2 phase 220V | ||
Frequency | 50/60 HZ | ||
Power | 800W | ||
weight | 240kg | 270kg | 280kg |
size | 1050*750*1400mm | 630*700*1350mm | 750*1050*1450mm |
Bonding speed | 50ms/wire for 2mm |
Bonding accuracy | ±3.0 μm |
Wire length | Max.8mm |
Wire diameter | 15-50μm |
Wire type | Au, Ag, Alloy, CuPd, Cu |
Bond type | Single line /BSOB/BBOS |
Loop control | Support ultra-low arc |
Bonding area | 56mm*65mm |
XY resolution | 0.1μm |
Transducer system | 138kHZ |
PR accuracy | ±0.37μm,±0.74μm |
Applicable magazine | 120-305*45-98*50-180mm |
Magazine pitch | Min 1.5mm |
Applicable lead frame | 100-300*40-90*0.1-1.3mm |
Different lead frame | <5min |
Same lead frame | <15min |
Operation interface | <4min |
Overall dimension | Chinese/English |
volume | 950mm*920*1850mm |
Weight | 750kg |
Voltage | 190~240V |
Frequency | 50HZ |
Compressed air | 0.6-0.97bar |
Air consumtion | 80L/min |