Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine

Product Details
After-sales Service: 1 Year
Function: Wire Bonder
Demoulding: Automatic
Diamond Member Since 2017

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  • Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
  • Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
  • Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
  • Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
  • Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
  • Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
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Basic Info.

Model NO.
MH
Condition
New
Certification
CE
Warranty
1 Year
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Specification
280kg
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description
High-speed wire bonding machine
Ultra-quiet workbench, creating an excellent working environment
Fully enclosed workbench extends the service life of mechanical parts
Mass separation XY table suitable for light load and high speed occasions
The position is more precise, meeting the demanding requirements of 0.18μm process wafers

CT3100
Speed: 5 wires/second
1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.
2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )

CT3000
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).

CT2300
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).

Shuttle 800B wire bonding machine
Fully enclosed copper wire gas protection device, anti-oxidation, low gas consumption;
The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;
The high-resolution 1μm XY table ensures the accuracy of the equipment;
Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.

Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSpecification
model CT2300 CT3000 CT3100A
Z stroke 0.4"
Resolution 1μm
Wire feeding degree 30° 30° (45° optional)
Wire diameter 1.0-2.0 MIL 0.8-2.0 MIL 1.0-2.0 MIL
Bonding force 15-80 gm
Bonding power 0-2W adjustable
Bonding time adjustable
Distance between 4.8 mm
Bonding head and base Work stage
XY stroke 2"*2" 2"*2" 3"*3"
Rotary range No limit
Base dimension Max rotary R: 380mm
transducer Light weight aluminum alloy
Process scan range XY ±1mm (Magnification 3.5 times)
Process scan range rotary ±15°
Optical system 2.5X process control
Storage Up to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chip
Voltage 2 phase 220V
Frequency 50/60 HZ
Power 800W
weight 240kg 270kg 280kg
size 1050*750*1400mm 630*700*1350mm 750*1050*1450mm
 
Bonding speed 50ms/wire for 2mm
Bonding accuracy ±3.0 μm
Wire length Max.8mm
Wire diameter 15-50μm
Wire type Au, Ag, Alloy, CuPd, Cu
Bond type Single line /BSOB/BBOS
Loop control Support ultra-low arc
Bonding area 56mm*65mm
XY resolution 0.1μm
Transducer system 138kHZ
PR accuracy ±0.37μm,±0.74μm
Applicable magazine 120-305*45-98*50-180mm
Magazine pitch Min 1.5mm
Applicable lead frame 100-300*40-90*0.1-1.3mm
Different lead frame <5min
Same lead frame <15min
Operation interface <4min
Overall dimension Chinese/English
volume 950mm*920*1850mm
Weight 750kg
Voltage 190~240V
Frequency 50HZ
Compressed air 0.6-0.97bar
Air consumtion 80L/min
Sample
Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineProduct details
Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachinePacking & Delivery
Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Our Factory
Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Semiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding MachineSemiconductor Packaging Equipment High-Speed Automatic Aluminum Wire Bonder IC Digital Tube Welder Wire Bonding Machine

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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