Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
Number of Foreign Trading Staff:
4
Sample Available
Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering Semiconductor Device Fabrication Wafer Fab Fab Reactive Ion Etching System Rie Failure Analysis Icp Ebeam Feol Beol, Fab Beol Wafer Fab Semiconductor Industry Equipment Wafer Chip High Precision Reactive Ion Etching Rie Syste Inductive Coupling Plasma Etching Icp Feol Waferfab, Semiconductor Device Fabrication Fab Wafer Fab Rie Reactive Ion Etching Failure Analysis Equipment Beol Feol and so on.
Diamond Member
Audited Supplier
