Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl

Product Details
Specification: 2450*2050*2550
Trademark: minder-hightech
Origin: Guangzhou
Diamond Member Since 2017

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  • Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
  • Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
  • Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
  • Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
  • Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
  • Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
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Basic Info.

Model NO.
MDFD-6BL MDFD-9BL
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description
Dual side polisher MDFD-6BL MDFD-9BL
1, Using AC variable frequency motor to drive, soft start and soft stop,very stable.
2, Grinder with 4 steps in process:light/middle/heavy press and revi
3,Using button to operate and control, easily and simple.
4,Oil pressure lifting gear very stable,sun gear can adjust the position.
5,Designed a slow cylinder to load workpiece, avoid breaking and be controlled.
6,Can control the number of grinding turns with the pre-counter.
7,Can use diamond wheel to maintain the grinding wheel.
8,Good rigidity as the spindle is with higher dimension design.
Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl
Application
Double side grinding and polishing for high hardness,thin,and high precision
product. metal or nonmetallic.
Like sapphire substrate, optical glass, quartz crystal, silicon wafer.

Specification:
MDFD-6BL
Grinding disc spec. 386*148*30 Maintain wheel method using maintail wheel
Planetary gear spec. DP 12 Z=66 =20º End lock cylinder 32*15mm
Planetary gear number 3<=N<=5 Main motor 1.5kw
Workpiece Thickness b 0.2mm<= b <=20mm Sand pump motor 0.125kw
Best workpiece diameter 120 Sand flow method circulation or point
Lifting height of great ring 35mm Accuracy 0.3u(10mm)
Lower grinding disc speed 0-60rpm Dimension 700*950*1950Hmm
Main cylinder 50*200mm Weight 600 kg
MDFD-9BL
Grinding disc spec. 640*235*30 Maintain wheel method using maintail wheel
Planetary gear spec. DP 12 Z=108 =20º End lock cylinder 32*15mm
Planetary gear number 3<=N<=5 Main motor 5.5kw
Workpiece Thickness b 0.2mm<= b <=20mm Sand pump motor 0.125kw
Best workpiece diameter 180 Sand flow method circulation
Lifting height of great ring 35mm Accuracy 0.3u(10mm)
Lower grinding disc speed 0-60rpm Dimension 1350*960*2450Hmm
Main cylinder 100*500mm Weight 2000 kg
sample
Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blFactory
Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blDetail
Semiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9blSemiconductor Device Fabrication Wafer Fab Fab Feol Beol Dual Side Polisher Mdfd-6bl Mdfd-9bl

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