Fab Beol Feol Wafer Fab Semiconductor Cleaning Equipment After Wafer Chemical Mechanical Polishing CMP Post Clean Chip Cleaner

• After-sales Service: 1 Year
• Warranty: 1 Year
• Cleaning Process: CMP Post Clean
• Model NO.: MH
• Style: CMP Post Clean
• Clean Type: CMP Post Clean
• Usage: CMP Post Clean
• Principle: Chemical Cleaning
• Fuel: Electric
• Certification: CE
• Control: CNC
• Automation: Automatic
• Condition: New
• Remote Control: With Remote Control
• Customized: Customized
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• HS Code: 8015809090
• Production Capacity: 1000

Product Description

CMP Post Clean

Cleaning Equipment after Wafer Chemical Mechanical Polishing
Fully automatic CMP cleaning machine


Machine features:
Strong process capability
Dual chamber brushing, with a wide range of process applicability
The equipment occupies a small area, with dimensions of 2200 * 800 * 2200 (mm)
Application Fields:
6-8 inch CMP after brushing
Cleaning after grinding SIC or other substrates
Technical parameters:
Cleaning after 4-inch and 6-inch CMP
Dual chamber design, independent chamber operation Wet in and dry out or dry in and dry out
High speed spin dry SRD
LoadPort unit, loading unit:
LoadPort is the loading unit of this device Wet Cassette feeding
Has spray moisturizing function

Brush unit, Wafer cleaning unit:
Dual chamber unit, capable of supporting two different cleaning solutions
The brushing position can be adjusted according to the recipeBelt Conveyor

SRD unit, Wafer drying unit:
Wafer clamp type spin drying, with a maximum speed of 4000RPM
Can perform AS cleaning on wafer surface and spray DIW

UNLOAD unit, cutting unit:
The UnLoad unit has an independent FFU to ensure the cleanliness of wafer output
Conveyor:
Wet area is belt conveyorDry area for Robot teleportation
Brush unit description:
As shown in the left figure, the brush unit of this device
consists of two brushing units, namely BU1 BU2 , The
brush pressure of each unit can be adjusted separately (as specified in the recipe), and each brush blade unit can be  washed with different chemical cleaning solutions
separately.
The brush of the machine adopts PVA brush, which is a commonly used type in the market.
The transmission between cavities is belt conveyor. There is a DIW RINSE inside the cavity
SRD unit:
The SRD unit is equipped with a clamping CHUCK and an AS ARM, which can further physically clean and spin dry   the wafer surface.
 

Equipment size:	2200 * 800 * 2200 (mm)
Loading and unloading methods	dry in/wet in/dry out
Number of brushing units	2
Number of SRD units	1
Transport method	Wet zone belt transport, dry zone robot transport
The size of the equipment with a brushing chamber of 1 is 1850 * 800 * 2200

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.