Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven

Product Details
After-sales Service: 1 Year
Condition: New
Certification: CE
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
  • Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
  • Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
  • Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
  • Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
  • Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
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Basic Info.

Model NO.
MDVES400
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Transport Package
Wooden Case
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090

Product Description

Vacuum Eutectic Reflow Soldering Oven System

The welding porosity can be as low as 1-3% with advanced PID regulation and upper and lower heating systems, with temperature control at around 1 ° C; The welding cycle time is about 8-12 minutes, which can support various process gases such as nitrogen, nitrogen/hydrogen mixture, formic acid, etc; The equipment chamber cover has automatic opening and closing functions.
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Application

IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.
Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering OvenSemiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering OvenSemiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven

Product description

The design basis of the MDVES200 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.
The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.
MUX200 is a 10L cavity, the cost performance of the product is relatively high, which can meet the needs of research and production customers.

Features

1. MDVES200 is a cost-effective product with a small footprint and complete functions, which can meet customer R&D and initial production use;
2. The standard configuration of formic acid, nitrogen and nitrogen-hydrogen gas can meet the gas demand of various products of customers, without the trouble of adding process gas pipeline for the follow-up;
3. Adopting water cooling control can increase the cooling rate, so that the production rate can be increased and the production can be maximized; 4. When the customer relates to the vacuum sealing of the tube shell, the water cooling design will highlight the advantages and avoid the air cooling caused by the tube sheet and The puncture problem of the tube shell.
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Specification
 
Structure size
Basic frame 820*820*1000mm
cavity volume 10L
Maximum height of base 100mm
Observation window include
Weight 320KG
Vacuum system
Vacuum pump Vacuum pump with oil pollution filtering device
Vacuum level Up to 5Pa
Vacuum configuration 1. Vacuum pump
2. Electric valve
Pumping speed control The pumping speed of the vacuum pump can be set by the host computer software
Pneumatic system
Process gas N2, N2 / H2 (95% / 5%), HCOOH
First gas path Nitrogen/nitrogen-hydrogen mixture (95%/5%)
Second gas path HCOOH
Heating and cooling system
Heating method Radiant heating, contact conduction, heating rate 150ºC/min
Cooling method Contact cooling, the maximum cooling rate is 120ºC/min
Hot plate material copper alloy, thermal conductivity: 200W/m·ºC
Heating size 240*210mm
Heating device Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech.
Temperature range Max 400ºC
Power requirements 380V, 50/60HZ three-phase, maximum 40A
Control System Siemens PLC + IPC
Equipment power
Coolant Antifreeze or distilled water
20ºC
Pressure: 0.2~0.4Mpa
coolant flow rate >100L/min
Water tank water capacity 60L
Inlet water temperature 20ºC
Air source 0.4MPaair pressure0.7MPa
Power supply single-phase three-wire system 220V, 50Hz
Voltage fluctuation range single phase 200~230V
Frequency fluctuation range 50HZ±1HZ
Equipment power consumption about 5KW; grounding resistance 4Ω;

Standard configuration:

Host system including vacuum chamber,main frame, control hardware and software
Nitrogen pipeline Nitrogen or nitrogen/hydrogen mixture can be used as process gas
Formic acid pipeline Bringing formic acid into the process chamber via nitrogen
Water cooling pipeline cooling the upper cover, lower cavity and heating plate
Water cooler Provide continuous water cooling supply to equipment
Vacuum pump Vacuum pump system with oil mist filtration

Operation Conditions:

Temperature 10~35ºC
Relative humidity 80%
The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals.

Semiconductor Welding Equipment Vacuum Reflux Furnace Vacuum Eutectic Reflow Soldering Oven System Vacuum Soldering Oven
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

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FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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