Semiconductor Equipment High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine

• After-sales Service: 1 Year
• Condition: New
• Speed: Super High Speed
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: MDXK-SHA1030
• Automatic Grade: Automatic
• Type: Ultra High-speed Chip Mounter
• Trademark: minder-hightech
• Origin: China

Product Description

MDXK-SHA1030
Fully automatic eclectic bonder

Product characteristics
1. Two in one crystal overlay and direct solidification.
2. High yield, high-speed welding head+dual silver paste dispensing system (optional).
3. When in die bond mode, use the dual silver paste dispensing/dispensing system (optional) to double the speed of dispensing/dispensing.
4. Online capability, achieving production automation, excellent yield and accuracy.
5. Excellent accuracy, crystal coverage: ± 10 µ m @ 3 σ, Rotate the suction nozzle welding arm to improve angular accuracy.
6. Excellent flux thickness control.
7. Two stage feeding system, needle free feeding system, suitable for thin chip processing.


Parametric Metrics

XY placement accuracy	±0.4 mil (±10 µm) @ 3σ
Chip deflection
5 mm< Die size <10 mm	±0.15° @ 3σ
1 mm< Die size < 5 mm	±0.3° @ 3σ
0.25 mm< Die size < 1 mm	±1° @ 3σ
Die bond mode
XY Welding position accuracy	±1 mil (±25 µm) @ 3σ
Chip deflection
Die size ≥ 1 mm	±0.5° @ 3σ
Die size < 1 mm	±1° @ 3σ
Material processing capacity
Die size	0.25x0.25 mm2-10x10mm2
Wafer size
standard	12" (300 mm)
optional	6" (150 mm) / 8" (200 mm)
Lead frame size
Length	100 - 300 mm
width	15 - 100mm
height
standard	0.1 - 0.8 mm
optional	0.8 - 2.0 mm
Box size
Length	110 - 310 mm
width	20 - 110 mm
height	70 - 153 mm
Welding head system
Die bond pressure	30 - 3,000 g (Programmable)
Image recognition system
Image recognition system	256 grayscale levels
Required facilities
voltage	110/120/220/240 VAC
frequency	50/60 Hz (Factory pre-set)
Maximum load current	10.5A @ 220 V
compressed air	minimum 87 PSI (6 bar)
Number of compressed air inlets	2 (Ø10mm outer diameter of rubber hose)
consumption	1,800 W (Equipped with heater) 1,500 W (Not equipped with heater)
Dimension
size	Width x depth x height
Including the loading and unloading lifting platform	93.7" x 56.3" x 76.2" (2,380 mm x 1,430 mm x 1,935 mm)
weight	3960 pounds (1,800 kg)

Factory Environment

Product maintenance
There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours

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