| After-sales Service: | 1 Year |
|---|---|
| Condition: | New |
| Speed: | Super High Speed |
|
Still deciding? Get samples of US$ 100/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Description:
3.1 LF station
3.1.1 magazine upload;
3.1.2 magazine exchange without stop;
3.1.3 magazine contain quantity: 3pcs;
3.2 LF dispensing station
Optional sringe dispenser and stamping dispensing;
3.3 Swing arm die picking up station1
3.3.1 rotary use high torch 2000w servo motor control, 180degree swing,can adjust sucker pressure
3.3.2 die placement accuracy:<±25um>;
3.3.3 die placement angle accurcy:<±3o >;
3.3.4 die missing check.
3.4 wafer atation1
3.4.1 with 12inch wafer station acceptable 8inch;
3.4.2 wafer auto-expanding function;
3.4.3 CCD system check and position wafer;
3.4.4 automatic adjust the wafer anlge..
3.5 correcting station
3.5.1 use linear motor and high precision grating to insure the accuracy.
3.5.2 rotary use 5 phase motor control
3.6 linear die picking up station 2
3.6.1 linear method pick and place die, pressure adjustable.
3.6.2 die placement accuracy:<±15um~±25um>;
3.6.3 die angle accuracy:<±1o >;
3.6.4 die missing check.
3.7 receipt
3.7.1 stackable magazine receiption;
3.7.2 non-stoping when receition
Basic funtion:
4.4.1 system: Windows 7
4.4.2 interface:chinese & english
4.4.3 cycle time:720ms(Max) UPH≥5K
4.4.4 whole position accuracy:±15um~±25um
4.4.5 whole angle position:±1°
4.4.6 die size:1mm*1mm~10mm*10mm
4.4.7 LF size:length≤260mm width≤80mm
4.4.8 power:220V±10V,50HZ 700W
4.4.9 air(pressure):5~6Kgf/cm 2
Funtion:
5.5.1 die missing checking fuction
5.5.2 no limit program number stortage
5.5.3 external UPS system
5.5.4 internal vaccum pump
5.5.5 with Mapping function
5.5.6 die bonding quality check
5.5.7 reverse check function
5.5.8 size and weight:
5.5.8.1 LWH:2200mm*1400mm*1600mm ()
5.5.8.2 Weight:1500Kg
Die picking up station:
6.6.1 pick up tool:surface picking up
6.6.2 swing arm:180°rotoray
6.6.3 picking up pressure:20g~200g
Die bonding station:
7.7.1 head:rotary,surface mounter
7.7.2 die attach side:linear moving
7.7.3 die attach pressure:20g~200g
7.7.4 wafer station:
7.7.5 max stroke:12" × 12" (325 mm × 325mm)
7.7.6 repeat accuracy:±2um
7.7.7 ejector stroke: 3mm (Max)
Linear die bonding system:
8.8.1repeat accuracy:±2um
Dispensing system:
9.9.1 dual dispensing system
10)upload and download system
10.10.1magazine
10.10.2 max lead frame size:80 mm ×260mm
){kind=link}