Guangdong, China
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing ...
Year of Establishment:
2014-12-30
Registered Capital:
147802.18 USD
Main Markets:
South America, Europe, Southeast Asia/ Mideast
Portuguese Speaker

Wire Bonding Machine, Wedge Bonding Machine, Thin Wire Bonding Machine manufacturer / supplier in China, offering Manual Ultrasonic Thin Wire Wedge Bonding Machine Mdb2575, Ultrasonic Metal Welding Machine, Ultrasonic Metal Welding Machine for Electrical Wire End Crimps and so on.

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Supplier Homepage Products Wire bonders Manual wire bonder Manual Ultrasonic Thin Wire Wedge Bonding Machine Mdb2575

Manual Ultrasonic Thin Wire Wedge Bonding Machine Mdb2575

Get Latest Price
Min. Order / Reference FOB Price
1 Piece US $1-5,000/ Piece
Port: Guangzhou, China
Production Capacity: 500/Year
Payment Terms: T/T
Transport Package: Plywood Packing by Fast Express
Specification: 50kg
Trademark: minder-hightech
Origin: Guangzhou

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Basic Info

Model NO.: mdb-2575
HS Code: 8515809090

Product Description

Manual Ultrasonic Thin Wire Wedge Bonding Machine Mdb2575
Application:

 COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

   1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

   2,wire diameter:25~75μm wedge bonding.

   3,ultrasonic power:0-3W, two channel. can be set separately of the two point

   4,bond time:5-200ms,two channel

   5,bond force:10-60g,two channel

   6, span between first bond to second bond by automatic mode:0-10mm(motorized)

   7,bond radian: 0-6mm(motorized)

   8, jig moving area: Φ16mm

   9,mouse hand:20*20mm

   10,digital camera: optional

   11,dimension:600*560*390mm

   12,weight:36kg

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
cellphone0086-15813334038

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