Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi

• After-sales Service: 1 Year
• Demoulding: Automatic
• Condition: New
• Certification: CE
• Warranty: 24 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Trademark: MINDER-HIGHTECH
• Origin: China
• Production Capacity: 1000

Product Description

Product Description

 Welding Line Inspection Equipment

Introduction to Main Modules
Feeding Machine:
1.Manually place the full material box onto the loading position. After scanning for confirmation, it will flow into the individual box loading position. Defective products will be automatically discharged to the lower level for manual handling.
2.The materials in the full boxes are pushed piece by piece to the loading mechanism, and empty boxes are discharged from the lower level.
Inspection Machine:
1.The product conveying mechanism transfers the materials to the testing machine track, and the clamping jaws transport the materials to the inspection station.
2.After inspection, mapping is generated in real-time, supporting access to the database from multiple machines. NG (non-conforming) products can also be optionally marked with inkjet or laser marking.
Unloading Machine:
1.The qualified product conveying mechanism places the inspected products piece by piece into empty boxes, and the full boxes are discharged from the lower level.
2.The equipment can be quickly dismantled in sections and supports connection with upstream and downstream equipment.

Technical Parameter

Project	Content
Product Type	Strip-shaped solder pad, frame and substrate-type solder wire products
Inspection Items	Die shedding, offset, die reversed, error, silver paste/foreign object, contamination, scratch, chipping, broken edge, die crack, insufficient silver paste, miss wire, ball shedding,abnormal ball, ball offset, 2nd bonding shedding, 2nd bonding offset, 2nd bonding abnormal, broken wire, wire bending, tail length, foreign object
UPH	40-80strips/H(Determined by the size of the material strip and the size of the die)
Precision	5μm/pixel

Software Introduction
1.Developed specifically for the inspection of welding line appearance.
2.Automatic adjustment of track width, ranging from 15 to 100mm, compatible with production, and rapid recipe switching.
3.Automatic generation of mapping and production reports.
4.Combination of traditional algorithms and AI for fast and acc Combination of traditional algorithms and AI for fast and accurate defect.