Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi

Product Details
After-sales Service: 1 Year
Function: Aoi
Demoulding: Automatic
Diamond Member Since 2017

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1000000 RMB
  • Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
  • Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
  • Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
  • Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
  • Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
  • Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
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Basic Info.

Model NO.
MH
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Trademark
minder
Origin
China

Product Description

Welding Line Inspection Equipment
Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
Project Content
Product Type Strip-shaped solder pad, frame and substrate-type solder wire products
Inspection Items Die shedding, offset, die reversed, error, silver paste/foreign object, contamination, scratch, chipping, broken edge, die crack, insufficient silver paste, miss wire, ball shedding,abnormal ball, ball offset, 2nd bonding shedding, 2nd bonding offset, 2nd bonding abnormal, broken wire, wire bending, tail length, foreign object
UPH 40-80strips/H(Determined by the size of the material strip
and the size of the die)
Precision 5μm/pixel

Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
Introduction to Main Modules
Feeding Machine:
1.Manually place the full material box onto the loading position. After scanning for
confirmation, it will flow into the individual box loading position. Defective products will be
automatically discharged to the lower level for manual handling.
2.The materials in the full boxes are pushed piece by piece to the loading mechanism, and
empty boxes are discharged from the lower level.
Inspection Machine:
1.The product conveying mechanism transfers the materials to the testing machine track,
and the clamping jaws transport the materials to the inspection station.
2.After inspection, mapping is generated in real-time, supporting access to the database
from multiple machines. NG (non-conforming) products can also be optionally marked
with inkjet or laser marking.
Unloading Machine:
1.The qualified product conveying mechanism places the inspected products piece by
piece into empty boxes, and the full boxes are discharged from the lower level.
2.The equipment can be quickly dismantled in sections and supports connection with
upstream and downstream equipment.

Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer AoiSemiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi

Software Introduction
1.Developed specifically for the inspection of welding line appearance.
2.Automatic adjustment of track width, ranging from 15 to 100mm, compatible with production, and rapid recipe switching.
3.Automatic generation of mapping and production reports.
4.Combination of traditional algorithms and AI for fast and acc Combination of traditional algorithms and AI for fast and accurate defect.
Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer AoiSemiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer AoiSemiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer AoiSemiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer AoiSemiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer AoiSemiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.


 

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