| After-sales Service: | 1 Year |
|---|---|
| Demoulding: | Automatic |
| Condition: | New |
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Wafer 2D Defect Inspection System
Introduction to Main Modules
EFEM:
1.Manual loading of 8-inch or 12-inch open cassettes at the feeding station and automatically switch the product track size for compatibility.
2.The robot adopts a drag-and-drop design, ignoring the influence of interlayer spacing.
3.With a material pushing interference alarm, there is a buffer distance and sensor alarm when the product is blocked.
Technical Parameter
| Project | Content |
| Product Type | 6", 8", 12" frame wafer |
| 2D Inspection ltems | Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive area, etc Cutting channel deviation and chipping |
| Cutting Path Inspection Items | 6", 8", 12" frame cassetee |
| Lens and Resolution | 2x(2.75um)/3.5x(1.57um)/ 5x(1.1um)/7.5x(0.73um)/10x(0.55um) |
| Precision | 0.55μm/pixel |
| Optional and Customized | INK module, IR module |
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