Semiconductor Manufacture Optical Measurement Testing Autonomous Optical Wafer 2D&3D Inspection Aoi System

• After-sales Service: 1 Year
• Demoulding: Automatic
• Condition: New
• Model NO.: MH
• Certification: CE
• Warranty: 24 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Product Type: 6",8",12" Wafer, 2.5D/3D Packaging
• 3D Inspection Project: Bump Height, Bump Coplanality
• Cassette &Transmission Method: 8"Smif , 12" Foup or Combination
• Precision: 0.55um/Pixel
• Trademark: MINDER-HIGHTECH
• Origin: China
• Production Capacity: 1000

Product Description

Product Description

Wafer 2D&3D  Optical Inspection AOI System

Software Introduction
1.Supports multi-level permissions and permission operation log functions
2.The equipment menu bar covers a wide range of functions
3.Automatically generates mapping and production reports
4.Displays task status in real-time.
5.Combines traditional algorithms with Al for fast and accurate defect
identification.
Technical Parameter

Project	Content
Product Type	6",8",12" wafer, 2.5D/3D packaging
2D Inspection ltems	Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc.
2D Metrology	Bump diameter, needle mark coordinates, RDL and TSV metrology, etc.
3D Inspection Project	Bump height, Bump coplanality
Cassette &Transmission Method	8"SMIF , 12" FOUP or combination
Lens and Resolution	2x(2.75um)13.5x(1.57um)5x(1.1um)17.5x(0.73um)110x(0.55um)
Precision	0.55um/pixel
Optional and Customized	Double sided OCR,3D module, supported by E84